×

化学成分 BUK9Y12-40E

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号封装封装说明总产品重量
BUK9Y12-40ESOT669LFPAK77.14000 mg
12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
MSLPPTMPPTMSLPPTMPPT
934067047115512601260Cabuyao, Philippines; Manchester, United Kingdom; Seremban, Malaysia; Shanghai, China; Hsin-chu, Taiwan; Sherman, United States Of America; Dongguan, ChinaLeaded
次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
DieDoped siliconSilicon (Si)7440-21-31.00000100.000001.29634
subTotal1.00000100.000001.29634
ClipCopper alloyCopper (Cu)7440-50-84.9900099.800006.46876
Iron (Fe)7439-89-60.007500.150000.00972
Phosphorus (P)7723-14-00.002500.050000.00324
subTotal5.00000100.000006.48172
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100049.05104
Iron (Fe)7439-89-60.056860.150000.07372
Phosphorus (P)7723-14-00.015160.040000.01966
subTotal37.91000100.0000049.14442
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.40889
FillerSilica -amorphous-7631-86-91.419396.300001.84002
Silica fused60676-86-016.2216072.0000021.02878
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.58413
PigmentCarbon black1333-86-40.067590.300000.08762
Polymer2,2'-[[[(oxiranylmethoxy)phenyl]methylene]bis[[(1,1-dimethylethyl)methylphenylene]oxymethylene]]bisoxirane129915-35-11.351806.000001.75240
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.64255
Non hazardousProprietary0.991324.400001.28509
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.57716
subTotal22.53000100.0000029.20664
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00050
Tin alloyTin (Sn)7440-31-53.8496299.990004.99043
subTotal3.85000100.000004.99093
Solder PasteLead alloyLead (Pb)7439-92-13.7277592.500004.83245
Silver (Ag)7440-22-40.100752.500000.13061
Tin (Sn)7440-31-50.201505.000000.26121
subTotal4.03000100.000005.22427
Solder PasteImpurityAntimony (Sb)7440-36-00.000850.030000.00110
Lead alloyLead (Pb)7439-92-12.6076592.470003.38042
Silver (Ag)7440-22-40.070502.500000.09139
Tin (Sn)7440-31-50.141005.000000.18278
subTotal2.82000100.000003.65569
total77.14000100.00000100.00000
备注:
1 此处是对使用物质的通用描述,因实际组成物质为专有成分,也没有正式的CAS登录号。如果有CAS登录号,此处显示最接近的结果。
免责声明
本文档中提供的所有信息只为考察或参考目的。本文档中的所有信息据信是准确和可靠的。但是,安世半导体对此处所含信息的准确性或完整性不做任何说明或保证,并对因使用此信息而带来的后果不承担任何责任。安世半导体可能随时更改本文档所发布的信息,恕不另行通知。来自不同生产地的产品可能存在细微差异。本文档将取代并替换之前就此提供的所有信息。本文档中的任何信息均不得被理解或解释为出售可接受的产品的要约,或者授予、转让或暗示任何版权、专利或其他工业或知识产权的任何许可。