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OL-PMCM4401VNE

OL-PMCM4401VNE

wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
OL-PMCM4401VNE WLCSP4 wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body 2015-07-07

相关文档

文件名称 标题 类型 日期
OL-PMCM4401VNE 3D model for products with OL-PMCM4401VNE package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
OL-PMCM4401VNE wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body Package information 2022-07-13
pmcm4401vne-ssmos_fr pmcm4401vne-ssmos_fr Reflow soldering 2015-07-10

采用此封装的产品

MOSFETs

型号 描述 快速访问
PMCM4401VNE 12V, N-channel Trench MOSFET