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OL-PMCM4401VPE

OL-PMCM4401VPE

WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)

外形图

封装版本 封装名称 封装说明 参考 发行日期
OL-PMCM4401VPE WLCSP4 WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2015-07-20

相关文档

文件名称 标题 类型 日期
OL-PMCM4401VPE 3D model for products with OL-PMCM4401VPE package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
OL-PMCM4401VPE WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) Package information 2022-07-13
pmcm4401vpe-ssmos_fr pmcm4401vpe-ssmos_fr Reflow soldering 2015-07-20

采用此封装的产品

MOSFETs

型号 描述 快速访问
PMCM4401VPE 12 V, P-channel Trench MOSFET