×

SOT974-2

SOT974-2

plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT974-2 DFN3314-16 plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body 2010-03-25

相关文档

文件名称 标题 类型 日期
SOT974-2 3D model for products with SOT974-2 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SOT974-2 plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body Package information 2022-06-15
SOT974-2_132 DFN3314-16; Reel pack for SMD, 7''; Q1/T1 product orientation Packing information 2020-12-16

采用此封装的产品

ESD protection, TVS, filtering and signal conditioning

型号 描述 快速访问