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WLCSP10_4-2-4

WLCSP10_4-2-4

wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
WLCSP10_4-2-4 WLCSP10 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body 2010-02-11

相关文档

文件名称 标题 类型 日期
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
WLCSP10_4-2-4 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP10_PCMF_PESD2USB3X_087 PCMF2USB3X and PESD2USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing 2016-03-21
WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 PCMF2USB3X, PCMF2HDMI2X and PESD2USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing information 2020-04-27

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