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WLCSP15_6-3-6

WLCSP15_6-3-6

wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
WLCSP15_6-3-6 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body 2010-02-11

相关文档

文件名称 标题 类型 日期
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 PCMF3USB3X, PCMF3HDMI2X and PESD3USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing information 2020-04-27

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ESD protection, TVS, filtering and signal conditioning

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PCMF3USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
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