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WLCSP6_3-2

WLCSP6_3-2

wafer level chip-size package; 6 bumps (3 x 2)

外形图

封装版本 封装名称 封装说明 参考 发行日期
WLCSP6_3-2 WLCSP6 wafer level chip-size package; 6 bumps (3 x 2) 2017-04-13

相关文档

文件名称 标题 类型 日期
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
WLCSP6_3-2 wafer level chip-size package; 6 bumps (3 x 2) Package information 2022-07-13

采用此封装的产品

MOSFETs

型号 描述 快速访问
PMCM6501UPE 20 V, P-channel Trench MOSFET