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Features and benefits
- 符合JEDEC标准no. 7A
- 输入电平:
- 对于74HC27:CMOS电平
- 对于74HCT27:TTL电平
- ESD保护:
- HBM JESD22-A114F超过2000 V
- MM JESD22-A115-A超过200 V
- 多种封装选择
- 额定温度范围为-40 °C至+85 °C和-40 °C至+125 °C
参数类型
型号 | Product status | Package name |
---|---|---|
74HC27DB | End of life | SSOP14 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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封装
下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74HC27DB | 74HC27DB,112 (935188790112) |
Obsolete | HC27 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
74HC27DB,118 (935188790118) |
Obsolete | HC27 | SOT337-1_118 |
Series
文档 (10)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74HC_HCT27 | Triple 3-input NOR gate | Data sheet | 2024-03-25 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
SOT337-1_118 | SSOP14; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
No documents available
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.