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BC55PAS

60 V, 1 A NPN medium power transistors

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

Features and benefits

  • High collector current capability IC and ICM

  • Reduced Printed-Circuit Board (PCB) area requirements

  • Exposed heat sink for excellent thermal and electrical conductivity

  • Two current gain selections

  • Leadless very small SMD plastic package with medium power capability

  • Suitable for Automatic Optical Inspection (AOI) of solder joint

  • AEC-Q101 qualified

Applications

  • Linear voltage regulators

  • Battery driven devices

  • MOSFET drivers

  • High-side switches

  • Power management

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) Polarity Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Tj [max] (°C) fT [min] (MHz) Automotive qualified
BC55PAS SOT1061D DFN2020D-3 2 x 2 x 0.65 NPN 420 60 1000 63 250 150 100 Y

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BC55PAS BC55PASX
(934068127115)
Active CG SOT1061D
DFN2020D-3
(SOT1061D)
SOT1061D REFLOW_BG-BD-1
SOT1061D_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BC55PAS BC55PASX BC55PAS rohs rhf rhf
品质及可靠性免责声明

文档 (16)

文件名称 标题 类型 日期
BC55XPAS_SER 60 V, 1 A NPN medium power transistors Data sheet 2023-05-02
AN90023 Thermal performance of DFN packages Application note 2020-11-23
AN90023_ZH Thermal performance of DFN packages Application note 2021-02-26
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧轻便的汽车 二极管和晶体管 Brochure 2022-04-26
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧轻便的汽车 二极管和晶体管 Brochure 2022-04-26
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020D-3_SOT1061D_mk plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061D plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-10-10
SOT1061D_115 DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation Packing information 2020-05-29
BC55PAS_Nexperia_Product_Quality BC55PAS Nexperia Product Quality Quality document 2019-05-20
BC55PAS_Nexperia_Product_Reliability BC55PAS Nexperia Product Reliability Quality document 2023-04-04
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BC55PAS BC55PAS SPICE model SPICE model 2024-03-26

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BC55PAS BC55PAS SPICE model SPICE model 2024-03-26
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BC55PAS BC55PASX 934068127115 Active SOT1061D_115 3,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BC55PAS BC55PASX 934068127115 SOT1061D 订单产品