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BC69PAS series

20 V, 2 A PNP medium power transistors

PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

NPN complement: BC68PAS series

特性

  • High collector current capability IC and ICM

  • Reduced Printed-Circuit Board (PCB) area requirements

  • Exposed heat sink for excellent thermal and electrical conductivity

  • AEC-Q101 qualified

  • Two current gain selections

  • Leadless very small SMD plastic package with medium power capability

  • Suitable for Automatic Optical Inspection (AOI) of solder joint

目标应用

  • Linear voltage regulators

  • Battery driven devices

  • MOSFET drivers

  • High-side switches

  • Power management

  • Amplifiers

参数类型

Type numberPackage versionPackage nameSize (mm)PolarityPtot (mW)VCEO [max] (V)IC [max] (mA)hFE [min]hFE [max]Tj [max] (°C)fT [min] (MHz)
BC69-16PASSOT1061DDFN2020D-32 x 2 x 0.65PNP420-20-200010025015040
BC69-25PASSOT1061DDFN2020D-32 x 2 x 0.65PNP420-20-200016037515040
BC69PASSOT1061DDFN2020D-32 x 2 x 0.65PNP420-20-20008537515040

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
BC69-16PAS
DFN2020D-3
(SOT1061D)
SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveC2BC69-16PASX
( 9340 681 12115 )
BC69-25PAS
DFN2020D-3
(SOT1061D)
SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveC3BC69-25PASX
( 9340 681 13115 )
BC69PAS
DFN2020D-3
(SOT1061D)
SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveC1BC69PASX
( 9340 681 11115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
BC69-16PASBC69-16PASXBC69-16PASAlways Pb-free
BC69-25PASBC69-25PASXBC69-25PASAlways Pb-free
BC69PASBC69PASXBC69PASAlways Pb-free
品质及可靠性免责声明

文档 (5)

文件名称标题类型日期
BC69PAS_Nexperia_Product_QualityBC69PAS Nexperia Product QualityQuality document2019-05-20
BC69PAS_Nexperia_Product_ReliabilityBC69PAS Nexperia Product ReliabilityQuality document2023-04-04
BC69PASBC69PAS SPICE modelSPICE model2024-03-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1061Dplastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm bodyPackage information2022-10-10

支持

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模型

文件名称标题类型日期
BC69PASBC69PAS SPICE modelSPICE model2024-03-27

订购、定价与供货

样品

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