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BCP51

45 V, 1 A PNP medium power transistors

PNP medium power transistors in a SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Features and benefits

  • High current

  • Three current gain selections

  • High power dissipation capability

  • AEC-Q101 qualified

Applications

  • Linear voltage regulators

  • High-side switches

  • Battery-driven devices

  • Power management

  • MOSFET drivers

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) Polarity Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Tj [max] (°C) Automotive qualified
BCP51 SOT223 SC-73 6.5 x 3.5 x 1.65 PNP 650 -45 -1000 63 250 150 Y

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BCP51 BCP51,115
(933917270115)
Active BCP51 SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BCP51 BCP51,115 BCP51 rohs rhf rhf
品质及可靠性免责声明

文档 (15)

文件名称 标题 类型 日期
BCP51_SER 45 V, 1 A PNP medium power transistors Data sheet 2023-10-16
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
DERATSMD Power Derating Curves for SMDs; General Other type 1999-05-06
LSYMTRA Letter Symbols - Transistors; General Other type 1999-05-06
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
BCP51_Nexperia_Product_Quality BCP51 Nexperia Product Quality Quality document 2019-05-20
BCP51_Nexperia_Product_Reliability BCP51 Nexperia Product Reliability Quality document 2023-04-04
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BCP51 BCP51 SPICE model SPICE model 2024-03-26
BCP51 Cad-Symbol of BCP51 Software 2008-11-20
BCP51_cauer BCP51 RC thermal cauer model Thermal design 2020-06-22
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BCP51 BCP51 SPICE model SPICE model 2024-03-26
BCP51_cauer BCP51 RC thermal cauer model Thermal design 2020-06-22
SOT223 3D model for products with SOT223 package Design support 2019-01-22

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BCP51 BCP51,115 933917270115 Active SOT223_115 1,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BCP51 BCP51,115 933917270115 SOT223 订单产品