Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationPBSS5612PA
12 V, 6 A PNP low VCEsat (BISS) transistor
PNP低VCEsat突破性小信号(BISS)晶体管,采用超薄SOT1061无引脚小型表面贴装器件(SMD)塑料封装,具有中等功率能力。
NPN补充产品:PBSS4612PA。
Alternatives
Features and benefits
- 低集电极-发射极饱和电压VCEsat
- 高集电极电流能力IC和ICM
- 所需的印刷电路板(PCB)面积相比传统晶体管的更小
- 外露式热沉,可实现出色的热、电传导性能
- 无引脚小型SMD塑料封装,具有中等功率能力
Applications
- 负载开关
- 电池驱动设备
- 电源管理
- 充电电路
- 电源开关(例如:马达、风扇)
参数类型
型号 | Package version | Package name | Size (mm) | Polarity | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|
PBSS5612PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 500 | -12 | -6000 | 220 | 40 | N |
封装
下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PBSS5612PA | PBSS5612PA,115 (934063494115) |
Obsolete | A9 |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS5612PA | 12 V, 6 A PNP low V_CEsat (BISS) transistor | Data sheet | 2010-05-31 |
AN11045 | Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors | Application note | 2013-03-04 |
AN11076 | Thermal behavior of small-signal discretes on multilayer PCBs | Application note | 2021-06-23 |
SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
PBSS5612PA_Nexperia_Product_Quality | PBSS5612PA Nexperia Product Quality | Quality document | 2019-05-20 |
PBSS5612PA_Nexperia_Product_Reliability | PBSS5612PA Nexperia Product Reliability Quality document | Quality document | 2020-03-11 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PBSS5612PA | PBSS5612PA SPICE model | SPICE model | 2024-04-05 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS5612PA | PBSS5612PA SPICE model | SPICE model | 2024-04-05 |
SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.