Documentation
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN11304 | MOSFET load switch PCB with thermal measurement | Application note | 2013-01-28 |
| AN90009 | Leakage of small-signal MOSFETs | Application note | 2019-11-08 |
| AN90017 | Load switches for mobile and computing applications | Application note | 2020-09-02 |
| sot8026_3d | DSN1006-3; chip-scale package; 3 terminals; body 1 x 0.6 x 0.2 mm | Outline 3d | 2021-07-19 |
| SOT8026 | chip-scale package; 3 terminals; body 1.0 x 0.6 x 0.2 mm | Package information | 2023-02-28 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022 | High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages | Leaflet | 2022-07-04 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022-CHN | 适合移动和便携式设备的 大批量小信号MOSFET， 采用WLCSP和无引脚DFN封装 | Leaflet | 2022-07-04 |
| RS3885_DSN1006-SOT8026_Combi | DSN1006 (SOT8026) MARCOM image | Marcom graphics | 2022-06-06 |
| AN90036 | Recommendations for Printed Circuit Board assembly of DSN1006-3 (SOT8026) | Application note | 2022-08-09 |