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化学成分 PSMN072-100MSE

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号封装封装说明总产品重量
PSMN072-100MSESOT1210mLFPAK25.51000 mg
12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
MSLPPTMPPTMSLPPTMPPT
934663733115212601235Cabuyao, Philippines; Sherman, United States Of America; Cardiff, Great Britain; Manchester, United KingdomLeaded
次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
DieDoped siliconSilicon (Si)7440-21-30.62000100.000002.43042
subTotal0.62000100.000002.43042
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000022.29949
Iron (Fe)7439-89-60.008550.150000.03352
Phosphorus (P)7723-14-00.002850.050000.01117
subTotal5.70000100.0000022.34418
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000054.37946
Iron (Fe)7439-89-60.020850.150000.08173
Phosphorus (P)7723-14-00.006950.050000.02724
subTotal13.90000100.0000054.48843
Mould CompoundFillerSilica fused60676-86-00.8250082.500003.23403
HardenerPhenol/polymer with 4.4'-bis(methoxymethyl)1.1'-bisphenyl205830-20-20.081008.100000.31752
PigmentCarbon black1333-86-40.005000.500000.01960
PolymerFormaldehyde, polymer with 2-methoxynaphthalene and 2-methylphenol, glycidyl ether944410-31-50.089008.900000.34888
subTotal1.00000100.000003.92003
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00151
Tin alloyTin (Sn)7440-31-53.8496299.9900015.09061
subTotal3.85000100.0000015.09212
Solder PasteLead alloyLead (Pb)7439-92-10.3330092.500001.30537
Silver (Ag)7440-22-40.009002.500000.03528
Tin (Sn)7440-31-50.018005.000000.07056
subTotal0.36000100.000001.41121
Solder PasteImpurityAntimony (Sb)7440-36-00.000020.030000.00009
Lead alloyLead (Pb)7439-92-10.0739892.470000.28999
Silver alloySilver (Ag)7440-22-40.002002.500000.00784
Tin alloyTin (Sn)7440-31-50.004005.000000.01568
subTotal0.08000100.000000.31360
total25.51000100.00000100.00000
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