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74AUP1T34

Low-power dual supply translating buffer

The 74AUP1T34 is a single dual supply translating buffer. Input A is referenced to VCC(A) and output Y is referenced to VCC(Y). Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 1.1 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.1 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Wide supply voltage range:

    • VCC(A): 1.1 V to 3.6 V

    • VCC(Y): 1.1 V to 3.6 V

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Each port operates over the full 1.1 V to 3.6 V power supply range

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1T34GMProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.21ultra low-40~1253238.4164XSON6
74AUP1T34GNProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.21ultra low-40~12536728.9227XSON6
74AUP1T34GSProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.21ultra low-40~12534936.7236XSON6
74AUP1T34GWProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.21ultra low-40~12529265.6165TSSOP5
74AUP1T34GXProduction1.1 - 3.61.1 - 3.6CMOS± 1.915.21ultra low-40~12528660.6160X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1T34GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepQ74AUP1T34GM,132
( 9352 805 17132 )
SOT886_115ActivepQ74AUP1T34GM,115
( 9352 805 17115 )
74AUP1T34GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepQ74AUP1T34GN,132
( 9352 917 52132 )
74AUP1T34GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepQ74AUP1T34GS,132
( 9352 928 76132 )
74AUP1T34GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepQ74AUP1T34GW,125
( 9352 805 16125 )
74AUP1T34GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActivepQ74AUP1T34GXH
( 9353 028 87125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1T34GM74AUP1T34GM,13274AUP1T34GMAlways Pb-free
74AUP1T34GM74AUP1T34GM,11574AUP1T34GMAlways Pb-free
74AUP1T34GN74AUP1T34GN,13274AUP1T34GNAlways Pb-free
74AUP1T34GS74AUP1T34GS,13274AUP1T34GSAlways Pb-free
74AUP1T34GW74AUP1T34GW,12574AUP1T34GWAlways Pb-free
74AUP1T34GX74AUP1T34GXH74AUP1T34GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1T34Low-power dual supply translating bufferData sheet2023-07-17
AN10161PicoGate Logic footprintsApplication note2002-10-29
Nexperia_document_guide_Logic_translatorsNexperia Logic TranslatorsBrochure2021-04-12
aup1t3474AUP1T34 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

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模型

文件名称标题类型日期
aup1t3474AUP1T34 IBIS modelIBIS model2014-12-14

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