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74CBTLV3253

Dual 1-of-4 multiplexer/demultiplexer

The 74CBTLV3253 provides a dual 1-of-4 high-speed multiplexer/demultiplexer with two common select inputs (S0, S1) and two output enable inputs (1OE, 2OE). The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. When pin nOE = LOW, one of the four switches is selected (low-impedance ON-state) with pins S0 and S1. When pin nOE = HIGH, all switches are in the high-impedance OFF-state, independent of pins S0 and S1.

To ensure the high-impedance OFF-state during power-up or power-down, nOE should be tied to the VCC through a pull-up resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver.

Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Supply voltage range from 2.3 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM JESD22-A114F exceeds 2000 V

    • MM JESD22-A115-A exceeds 200 V

    • CDM AEC-Q100-011 revision B exceeds 1000 V

  • 5 Ω switch connection between two ports

  • Rail to rail switching on data I/O ports

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA per JESD78B Class I level A

  • IOFF circuitry provides partial Power-down mode operation

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)VPASS (V)Logic switching levelsRON (Ω)f(-3dB) (MHz)Nr of bitstpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74CBTLV3253BQProduction2.3 - 3.63.3CMOS/LVTTL740020.2very low-40~1259313.762DHVQFN16
74CBTLV3253DProduction2.3 - 3.63.3CMOS/LVTTL740020.2very low-40~125929.652SO16
74CBTLV3253DSProduction2.3 - 3.63.3CMOS/LVTTL740020.2very low-40~12514842.0-SSOP16
74CBTLV3253PWProduction2.3 - 3.63.3CMOS/LVTTL740020.2very low-40~1251251.054.6TSSOP16

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74CBTLV3253BQ
DHVQFN16
(SOT763-1) 		SOT763-1SOT763-1_115ActiveTV325374CBTLV3253BQ,115
( 9352 899 97115 )
74CBTLV3253D
SO16
(SOT109-1) 		SOT109-1SO-SOJ-REFLOW
SO-SOJ-WAVE
SOT109-1_118Active74CBTLV3253D74CBTLV3253D,118
( 9352 899 98118 )
74CBTLV3253DS
SSOP16
(SOT519-1) 		SOT519-1SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE
SOT519-1_118ActiveTLV325374CBTLV3253DS,118
( 9352 900 01118 )
74CBTLV3253PW
TSSOP16
(SOT403-1) 		SOT403-1SSOP-TSSOP-VSO-WAVE
SOT403-1_118ActiveTLV325374CBTLV3253PW,118
( 9352 899 99118 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74CBTLV3253BQ74CBTLV3253BQ,11574CBTLV3253BQAlways Pb-free
74CBTLV3253D74CBTLV3253D,11874CBTLV3253DAlways Pb-free
74CBTLV3253DS74CBTLV3253DS,11874CBTLV3253DSAlways Pb-free
74CBTLV3253PW74CBTLV3253PW,11874CBTLV3253PWAlways Pb-free
品质及可靠性免责声明

文档 (13)

文件名称标题类型日期
74CBTLV3253Dual 1-of-4 multiplexer/demultiplexerData sheet2020-09-25
cbtlv3253cbtlv3253 IBIS modelIBIS model2013-04-07
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT763-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm bodyPackage information2023-05-11
SO-SOJ-WAVEFootprint for wave solderingWave soldering2009-10-08
SO-SOJ-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT109-1plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm bodyPackage information2023-11-07
SOT403-1plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm bodyPackage information2023-11-08
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SSOP-TSSOP-VSO-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
SOT519-1plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm bodyPackage information2022-06-20

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模型

文件名称标题类型日期
cbtlv3253cbtlv3253 IBIS modelIBIS model2013-04-07

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