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74AUP1G18

Low-power 1-of-2 demultiplexer with 3-state deselected output

The 74AUP1G18 is a 1-to-2 demultiplexer with a 3-state outputs. The device buffers the data on input A and passes it to output 1Y or 2Y, depending on whether the state of the select input (S) is LOW or HIGH. The unused output assumes the high impedence OFF-state. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G18GMProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~1252906.5145XSON6
74AUP1G18GNProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~12527511.7171XSON6
74AUP1G18GSProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~12527214.8177XSON6
74AUP1G18GWProduction0.8 - 3.6CMOS1.9 / -1.93.2ultra low-40~12526438.6153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
74AUP1G18GM
XSON6
(SOT886)
SOT886REFLOW_BG-BD-1
SOT886_132ActivepW74AUP1G18GM,132
( 9352 799 53132 )
SOT886_115ActivepW74AUP1G18GM,115
( 9352 799 53115 )
74AUP1G18GN
XSON6
(SOT1115)
SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepW74AUP1G18GN,132
( 9352 917 31132 )
74AUP1G18GS
XSON6
(SOT1202)
SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepW74AUP1G18GS,132
( 9352 928 55132 )
74AUP1G18GW
TSSOP6
(SOT363-2)
SOT363-2SOT363-2_125ActivepW74AUP1G18GW,125
( 9352 799 52125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G18GM74AUP1G18GM,13274AUP1G18GMAlways Pb-free
74AUP1G18GM74AUP1G18GM,11574AUP1G18GMAlways Pb-free
74AUP1G18GN74AUP1G18GN,13274AUP1G18GNAlways Pb-free
74AUP1G18GS74AUP1G18GS,13274AUP1G18GSAlways Pb-free
74AUP1G18GW74AUP1G18GW,12574AUP1G18GWAlways Pb-free
品质及可靠性免责声明

文档 (16)

文件名称标题类型日期
74AUP1G18Low-power 1-of-2 demultiplexer with 3-state deselected outputData sheet2023-07-17
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g18aup1g18 IBIS modelIBIS model2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

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模型

文件名称标题类型日期
aup1g18aup1g18 IBIS modelIBIS model2014-12-21

样品

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