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74LVC1G17

Single Schmitt trigger buffer

The 74LVC1G17 is a single buffer Schmitt-trigger. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • CMOS low power dissipation

  • IOFF circuitry provides partial Power-down mode operation

  • ±24 mA output drive (VCC = 3.0 V)

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Unlimited rise and fall times

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74LVC1G17GMProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125320163XSON6
74LVC1G17GNProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125358222XSON6
74LVC1G17GSProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125341231XSON6
74LVC1G17GVProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125278175TSOP5
74LVC1G17GWProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125319188TSSOP5
74LVC1G17GXProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125345211X2SON5
74LVC1G17GX4Production1.65 - 5.5CMOS/LVTTL± 321751low-40~125--X2SON4

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G17GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveVJ74LVC1G17GM,132
( 9352 771 81132 )
SOT886_115ActiveVJ74LVC1G17GM,115
( 9352 771 81115 )
74LVC1G17GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveVJ74LVC1G17GN,132
( 9352 917 81132 )
74LVC1G17GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveVJ74LVC1G17GS,132
( 9352 929 06132 )
74LVC1G17GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveV1774LVC1G17GV,125
( 9352 700 81125 )
74LVC1G17GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveVJ74LVC1G17GW,125
( 9352 700 79125 )
74LVC1G17GX
X2SON5
(SOT1226) 		SOT1226REFLOW_BG-BD-1
SOT1226_125ActiveVJ74LVC1G17GX,125
( 9352 983 79125 )
74LVC1G17GX4
X2SON4
(SOT1269-2) 		SOT1269-2SOT1269-2_147ActiveVJ74LVC1G17GX4Z
( 9356 900 05147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G17GW/C4935301945125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G17GM74LVC1G17GM,13274LVC1G17GMAlways Pb-free
74LVC1G17GM74LVC1G17GM,11574LVC1G17GMAlways Pb-free
74LVC1G17GN74LVC1G17GN,13274LVC1G17GNAlways Pb-free
74LVC1G17GS74LVC1G17GS,13274LVC1G17GSAlways Pb-free
74LVC1G17GV74LVC1G17GV,12574LVC1G17GVweek 36, 2003
74LVC1G17GW74LVC1G17GW,12574LVC1G17GWweek 36, 2003
74LVC1G17GX74LVC1G17GX,12574LVC1G17GXAlways Pb-free
74LVC1G17GX474LVC1G17GX4Z74LVC1G17GX4week 25, 2019
品质及可靠性免责声明

文档 (23)

文件名称标题类型日期
74LVC1G17Single Schmitt trigger bufferData sheet2023-08-15
lvc1g1774LVC1G17 IBIS modelIBIS model2018-05-25
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1226MAR_SOT1226 TopmarkTop marking2013-06-03
SOT1226plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm bodyPackage information2022-05-30
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1269-2plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm bodyPackage information2020-08-18
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1g1774LVC1G17 IBIS modelIBIS model2018-05-25

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