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74LVC1G332

Single 3-input OR gate

The 74LVC1G332 is a single 3-input OR gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • Overvoltage tolerant inputs to 5.5 V

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G332GF
NRND 		Not for design in-----------XSON6
74LVC1G332GMProduction1.65 - 5.5CMOS/LVTTL± 322.61501low-40~1253178.0161XSON6
74LVC1G332GNProduction1.65 - 5.5CMOS/LVTTL± 322.61501low-40~12535126.0218XSON6
74LVC1G332GSProduction1.65 - 5.5CMOS/LVTTL± 322.61501low-40~12533633.0226XSON6
74LVC1G332GVProduction1.65 - 5.5CMOS/LVTTL± 322.61501low-40~12526163.0172TSOP6
74LVC1G332GWProduction1.65 - 5.5CMOS/LVTTL± 322.61501low-40~12528456.2172TSSOP6
74LVC1G332GXProduction1.65 - 5.5CMOS/LVTTL± 322.61501low-40~125---X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G332GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveYG74LVC1G332GM,132
( 9352 826 86132 )
SOT886_115ActiveYG74LVC1G332GM,115
( 9352 826 86115 )
74LVC1G332GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYG74LVC1G332GN,132
( 9352 917 84132 )
74LVC1G332GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYG74LVC1G332GS,132
( 9352 929 11132 )
74LVC1G332GV
TSOP6
(SOT457) 		SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveYG74LVC1G332GV,125
( 9352 826 87125 )
74LVC1G332GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveYG74LVC1G332GW,125
( 9352 826 88125 )
74LVC1G332GX
X2SON6
(SOT1255-2) 		SOT1255-2SOT1255-2_147ActiveYG74LVC1G332GXZ
( 9353 070 75147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G332GF9352826891322021-06-302021-12-3174LVC1G332GS
    74LVC1G332GX935307075125

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74LVC1G332GM74LVC1G332GM,13274LVC1G332GMAlways Pb-free
    74LVC1G332GM74LVC1G332GM,11574LVC1G332GMAlways Pb-free
    74LVC1G332GN74LVC1G332GN,13274LVC1G332GNAlways Pb-free
    74LVC1G332GS74LVC1G332GS,13274LVC1G332GSAlways Pb-free
    74LVC1G332GV74LVC1G332GV,12574LVC1G332GVAlways Pb-free
    74LVC1G332GW74LVC1G332GW,12574LVC1G332GWAlways Pb-free
    74LVC1G332GX74LVC1G332GXZ74LVC1G332GXAlways Pb-free
    品质及可靠性免责声明

    文档 (24)

    文件名称标题类型日期
    74LVC1G332Single 3-input OR gateData sheet2023-08-18
    AN10161PicoGate Logic footprintsApplication note2002-10-29
    AN11009Pin FMEA for LVC familyApplication note2019-01-09
    lvc1g33274LVC1G332 IBIS modelIBIS model2015-09-06
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
    SOT1255-2plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mmPackage information2020-08-27
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    SOT891plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm bodyPackage information2020-04-21
    MAR_SOT891MAR_SOT891 TopmarkTop marking2013-06-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

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    模型

    文件名称标题类型日期
    lvc1g33274LVC1G332 IBIS modelIBIS model2015-09-06

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