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LSF0108

8-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0108 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

特性

  • Bidirectional voltage translation with no direction pin

  • Up translation

    • ≤ 100 MHz; CL = 30 pF

    • ≤ 40 MHz; CL = 50 pF

  • Down translation

    • ≥ 100 MHz; CL = 30 pF

    • ≤ 40 MHz; CL = 50 pF

  • Hot insertion

  • Bidirectional voltage level translation between:

    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.8 V and 2.5 V, 3.3 V and 5.0 V

    • 2.5 V and 3.3 V and 5.0 V

    • 3.3 V and 5.0 V

  • Low standby current

  • 5 V tolerant I/O pins to support TTL

  • Low RON provides less signal distortion

  • High-impedance I/O pins for EN = Low.

  • Flow-through pinout for easy PCB trace routing.

  • Latch-up performance exceeds 100 mA per JESD78 class II level A

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 exceeds 2000 V

    • CDM ANSI/ESDA/JEDEC JS-002 exceeds 1000 V

  • Specified from -40 °C to +125 °C

目标应用

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure

  • Industrial

  • Personal computing

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
LSF0108BQProduction0.95 - 5.00.95 - 5.0CMOSn.a.1.48low-40~125778.749DHVQFN20
LSF0108PWProduction0.95 - 5.00.95 - 5.0CMOSn.a.1.48low-40~1251004.545TSSOP20

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
LSF0108BQ
DHVQFN20
(SOT764-1)
SOT764-1SOT764-1_115ActiveLSF0108LSF0108BQX
( 9356 902 88115 )
LSF0108PW
TSSOP20
(SOT360-1)
SOT360-1SSOP-TSSOP-VSO-WAVE
SOT360-1_118ActiveLSF0108LSF0108PWJ
( 9356 902 89118 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
LSF0108BQLSF0108BQXLSF0108BQweek 25, 2019
LSF0108PWLSF0108PWJLSF0108PWweek 25, 2019
品质及可靠性免责声明

文档 (7)

文件名称标题类型日期
LSF01088-bit bidirectional multi-voltage level translator; open-drain; push-pullData sheet2023-11-28
AN90050Pin FMEA for LSF familyApplication note2023-12-14
lsf0108LSF0108 IBIS modelIBIS model2020-04-14
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2022-06-21
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2022-06-21

支持

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模型

文件名称标题类型日期
lsf0108LSF0108 IBIS modelIBIS model2020-04-14

订购、定价与供货

样品

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