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BCP56T-SERIES

80 V, 1 A NPN medium power transistors

NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Table 1. Product Overview

Type number

Package

PNP complement

Nexperia

JEITA

JEDEC

BCP56T

SOT223

SC-73

-

BCP53T

BCP56-10T

BCP53-10T

BCP56-16T

BCP53-16T

特性

  • High collector current capability IC and ICM
  • Three current gain selections
  • High power dissipation capability
  • AEC-Q101 qualified

目标应用

  • Linear voltage regulators
  • MOSFET drivers
  • High-side switches
  • Power management
  • Amplifiers

参数类型

Type numberPackage versionPackage nameSize (mm)PolarityPtot (mW)VCEO [max] (V)IC [max] (mA)hFE [min]hFE [max]Tj [max] (°C)fT [min] (MHz)
BCP56-10TSOT223SC-736.5 x 3.5 x 1.65NPN60080100063160150100
BCP56-16TSOT223SC-736.5 x 3.5 x 1.65NPN600801000100250150100
BCP56TSOT223SC-736.5 x 3.5 x 1.65NPN60080100063250150100

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
BCP56-10T
SC-73
(SOT223) 		SOT223REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115ActiveP5610TBCP56-10TX
( 9340 701 18115 )
SOT223_135ActiveP5610TBCP56-10TF
( 9340 701 18135 )
BCP56-16T
SC-73
(SOT223) 		SOT223REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135ActiveP5616TBCP56-16TF
( 9340 701 19135 )
SOT223_115ActiveP5616TBCP56-16TX
( 9340 701 19115 )
BCP56T
SC-73
(SOT223) 		SOT223REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135ActiveBCP56TBCP56TF
( 9340 701 17135 )
SOT223_115ActiveBCP56TBCP56TX
( 9340 701 17115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
BCP56-10TBCP56-10TXBCP56-10TAlways Pb-free
BCP56-10TBCP56-10TFBCP56-10Tweek 25, 2019
BCP56-16TBCP56-16TFBCP56-16Tweek 25, 2019
BCP56-16TBCP56-16TXBCP56-16TAlways Pb-free
BCP56TBCP56TFBCP56Tweek 25, 2019
BCP56TBCP56TXBCP56TAlways Pb-free
品质及可靠性免责声明

文档 (7)

文件名称标题类型日期
BCP56T_SER80 V, 1 A NPN medium power transistorsData sheet2022-06-30
BCP56T_Nexperia_Product_QualityBCP56T Nexperia Product QualityQuality document2019-05-20
BCP56T_Nexperia_Product_ReliabilityBCP56T Nexperia Product ReliabilityQuality document2023-04-04
BCP56TBCP56T SPICE modelSPICE model2024-03-27
SOT223plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm bodyPackage information2022-05-30
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
BCP56TBCP56T SPICE modelSPICE model2024-03-27

订购、定价与供货

样品

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