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ES2DP

200 V, 2 A hyperfast PN-rectifier

High power density, hyperfast PN-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead CFP5 (SOD128) Surface-Mounted Device (SMD) plastic package.

该产品已停产。参见单击此处了解停产信息和替代产品。

Features and benefits

  • Reverse voltage VR ≤ 200 V
  • Forward current IF ≤ 2 A
  • Hyperfast recovery time trr ≤ 25 ns
  • Pt doped life time control
  • Low inductance
  • Small and flat lead SMD plastic package
  • Package height typ. 1 mm
  • High power capability due to clip-bond technology
  • Capable for reflow and wave soldering
  • Planar die design

Applications

  • General-purpose rectification
  • Reverse polarity protection
  • Hyperfast switching
  • Freewheeling applications

参数类型

型号 Package version Package name Size (mm) VR [max] (V) IF(AV) per diode; [max] (A) IFSM [max] (A) VF [max] @25 C (mV) IR [max] @25 C (nA) Configuration trr [max] (ns) IF [max] (mA) Cd [typ] (pF) Automotive qualified
ES2DP SOD128 CFP5 3.8 x 2.5 x 1 200 2 46 950 200 single 25 2800 20 N

封装

下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
ES2DP ES2DPX
(934070394115)		 Obsolete DN SOD128
CFP5
(SOD128) 		SOD128 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOD128_115

环境信息

下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
ES2DP ES2DPX ES2DP rohs rhf
品质及可靠性免责声明

文档 (10)

文件名称 标题 类型 日期
ES2DP 200 V, 2 A hyperfast PN-rectifier Data sheet 2017-08-25
AN90002 Wave soldering guidelines for flatpack packages Application note 2023-11-02
Nexperia_document_brochure_CFP_Schottky_rectifier Schottky rectifiers in CFP packages Brochure 2020-01-28
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 CFP封装的肖特基整流器 Leaflet 2022-07-01
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
CFP5_SOD128_mk plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body Marcom graphics 2017-01-28
SOD128 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body Package information 2022-05-27
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
ES2DP ES2DP SPICE model SPICE model 2016-12-01
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
ES2DP ES2DP SPICE model SPICE model 2016-12-01

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册