×

PESD3V3L5UF

Low capacitance unidirectional fivefold ESD protection diode array

Low capacitance unidirectional fivefold ElectroStatic Discharge (ESD) protection diode array in a leadless ultra small XSON6 (SOT886) Surface-Mounted Device (SMD) plastic package, designed to protect up to five unidirectional signal lines from the damage caused by ESD and other transients.

Features and benefits

  • ESD protection of up to five lines

  • Low diode capacitance

  • Max. peak pulse power: PPPM = 25 W

  • Low clamping voltage: VCL = 12 V

  • Ultra low leakage current: IRM = 75 nA

  • ESD protection up to 20 kV

  • IEC 61000-4-2; level 4 (ESD)

  • IEC 61000-4-5 (surge); IPPM = 2.5 A

Application information

  • Computers and peripherals

  • Audio and video equipment

  • Cellular handsets and accessories

  • Communication systems

  • Portable electronics

  • SIM card protection

参数类型

型号 Package name Nr of lines Configuration VRWM (V) Cd [typ] (pF) VESD IEC61000-4-2 (kV)
PESD3V3L5UF XSON6 5 Unidirectional 3.3 22 20

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PESD3V3L5UF PESD3V3L5UF,115
(934061195115)
Active A1 SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PESD3V3L5UF PESD3V3L5UF,115 PESD3V3L5UF rohs rhf rhf
品质及可靠性免责声明

文档 (16)

文件名称 标题 类型 日期
PESDXL5UF_V_Y Low capacitance unidirectional fivefold ESD protection diode arrays Data sheet 2020-05-01
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT886_115 XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation Packing information 2020-04-21
PESD3V3L5UF_Nexperia_Product_Quality PESD3V3L5UF Nexperia Product Quality Quality document 2019-05-20
PESD3V3L5UF_Nexperia_Product_Reliability PESD3V3L5UF Nexperia Product Reliability Quality document 2023-04-04
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PESD3V3L5UF PESD3V3L5UF SPICE model SPICE model 2012-07-22
PESD3V3L5UF PESD3V3L5UF SPICE model SPICE model 2024-02-20
PESD3V3L5UY Cad-Symbol of PESD3V3L5UY Software 2008-11-20
PESD5V0L5UY Cad-Symbol of PESD5V0L5UY Software 2008-11-20
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PESD3V3L5UF PESD3V3L5UF SPICE model SPICE model 2012-07-22
PESD3V3L5UF PESD3V3L5UF SPICE model SPICE model 2024-02-20
SOT886 3D model for products with SOT886 package Design support 2019-10-03

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PESD3V3L5UF PESD3V3L5UF,115 934061195115 Active SOT886_115 5,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PESD3V3L5UF PESD3V3L5UF,115 934061195115 SOT886 订单产品