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Click here for more information74LV04DB
Hex inverter
74LV04是低压硅栅CMOS器件,与74HC04和74HCT04针脚和功能兼容。
74LV04提供六个反相缓冲器。
Alternatives
Features and benefits
- 宽工作电压范围:1.0 V至5.5 V
- 最适合低压应用:1.0 V至3.6 V
- 接受介于VCC = 2.7 V和VCC = 3.6 V之间的TTL输入电平
- VCC = 3.3 V且Tamb = 25 °C时的典型输出地弹:< 0.8 V
- VCC = 3.3 V且Tamb = 25 °C时的典型高电平输出电压(VOH)欠冲:> 2 V
- ESD保护:
- HBM JESD22-A114E超过2000 V
- MM JESD22-A115-A超过200 V
- 多种封装选择
- 额定温度范围为-40 °C至+85 °C和-40 °C至+125 °C
参数类型
型号 | Product status | Package name |
---|---|---|
74LV04DB | End of life | SSOP14 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
---|---|
|
封装
下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LV04DB | 74LV04DB,118 (935169260118) |
Withdrawn / End-of-life | LV04 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT337-1_118 |
74LV04DB,112 (935169260112) |
Obsolete | LV04 | Not available |
文档 (8)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LV04 | Hex inverter | Data sheet | 2021-09-13 |
lv04 | 74LV04 IBIS model | IBIS model | 2019-01-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lv | lv Spice model | SPICE model | 2013-05-07 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.