×

PSMN3R5-25MLD

N-channel 25 V, 3.72 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology

Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package. NextPowerS3 portfolio utilising Nexperia’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETS with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.

Features and benefits

  • Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies

  • Superfast switching with soft-recovery; s-factor > 1

  • Low spiking and ringing for low EMI designs

  • Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at 25 °C

  • Optimised for 4.5 V gate drive

  • Low parasitic inductance and resistance

  • High reliability clip bonded and solder die attach Mini Power SO8 package; no glue, no wire bonds, qualified to 175 °C

  • Exposed leads for optimal visual solder inspection

Applications

  • On-board DC:DC solutions for server and telecommunications

  • Secondary-side synchronous rectification in telecommunication applications

  • Voltage regulator modules (VRM)

  • Point-of-Load (POL) modules

  • Power delivery for V-core, ASIC, DDR, GPU, VGA and system components

  • Brushed and brushless motor control

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) RDSon [max] @ VGS = 4.5 V (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PSMN3R5-25MLD SOT1210 LFPAK33 Production N 1 25 3.72 5.41 175 70 2.1 8.7 18.9 65 13.5 1.73 N 1334 863 2016-03-22

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PSMN3R5-25MLD PSMN3R5-25MLDX
(934069916115)
Active 3D525L SOT1210
LFPAK33
(SOT1210)
SOT1210 REFLOW_BG-BD-1
SOT1210_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PSMN3R5-25MLD PSMN3R5-25MLDX PSMN3R5-25MLD rohs rhf
品质及可靠性免责声明

文档 (21)

文件名称 标题 类型 日期
PSMN3R5-25MLD N-channel 25 V, 3.72 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology Data sheet 2018-04-03
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN11156 Using Power MOSFET Zth Curves Application note 2021-01-04
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11160 Designing RC Snubbers Application note 2023-02-03
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90003 LFPAK MOSFET thermal design guide Application note 2023-08-22
SOT1210 3D model for products with SOT1210 package Design support 2017-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK33_SOT1210_mk Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body Marcom graphics 2017-01-28
SOT1210 Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch Package information 2022-06-03
SOT1210_115 LFPAK33; Reel pack for SMD, 7"; Q1/T1 product orientation Packing information 2022-06-07
Reliability__information_t9_sot1210 Reliability qualification information Quality document 2022-08-29
T9_SOT1210_PSMN3R5-25MLD_Nexperia_Quality_document Product Quality Quick Reference Information Quality document 2022-08-29
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PSMN3R5-25MLD PSMN3R5-25MLD SPICE model SPICE model 2016-04-07
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
PSMN3R5-25MLD_RC_Thermal_Model PSMN3R5-25MLD Thermal design model Thermal design 2021-01-18
PSMN3R5-25MLD PSMN3R5-25MLD Thermal model Thermal model 2016-04-07

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PSMN3R5-25MLD PSMN3R5-25MLD SPICE model SPICE model 2016-04-07
PSMN3R5-25MLD_RC_Thermal_Model PSMN3R5-25MLD Thermal design model Thermal design 2021-01-18
PSMN3R5-25MLD PSMN3R5-25MLD Thermal model Thermal model 2016-04-07
SOT1210 3D model for products with SOT1210 package Design support 2017-06-30

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PSMN3R5-25MLD PSMN3R5-25MLDX 934069916115 Active SOT1210_115 1,500 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PSMN3R5-25MLD PSMN3R5-25MLDX 934069916115 SOT1210 订单产品