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PMPB27EP

30 V, single P-channel Trench MOSFET

P沟道增强型场效应晶体管(FET),采用使用Trench MOSFET技术的无引脚中等功率DFN2020MD-6 (SOT1220)表面贴装器件(SMD)塑料封装。

Features and benefits

  • Trench MOSFET技术
  • 小型无引脚超薄SMD塑料封装:2 x 2 x 0.65 mm
  • 外露式漏极垫片,可实现出色的导热性
  • 100%可焊镀锡侧焊盘,支持光学焊点检查

Applications

  • 用于便携式设备的充电开关
  • DC-DC转换器
  • 电池驱动便携式设备的电源管理
  • 硬盘和计算能力管理

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) VGS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) RDSon [max] @ VGS = 4.5 V (mΩ) integrated gate-source ESD protection diodes Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMPB27EP SOT1220 DFN2020MD‑6 Production P 1 -30 20 29 43 N 150 -8.8 3.8 19 1.7 -1.5 N 1070 119.99999 2012-09-10

文档 (21)

文件名称 标题 类型 日期
PMPB27EP 30 V, single P-channel Trench MOSFET Data sheet 2017-05-04
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11304 MOSFET load switch PCB with thermal measurement Application note 2013-01-28
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧轻便的汽车 二极管和晶体管 Brochure 2022-04-26
SOT1220 3D model for products with SOT1220 package Design support 2018-08-23
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020MD-6_SOT1220_mk plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1220 plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-06-02
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
nexperia_report_aoi_inspection_dfn_201808 Automatic Optical Inspection of DFN Components Report 2018-09-03
nexperia_report_aoi_inspection_dfn_201808 Automatic Optical Inspection of DFN Components Report 2018-09-03
PMPB27EP_15_8_2012 PMPB27EP Spice model SPICE model 2013-12-12
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PMPB27EP_15_8_2012 PMPB27EP Spice model SPICE model 2013-12-12
SOT1220 3D model for products with SOT1220 package Design support 2018-08-23

订购、定价与供货

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.