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BUK6Y61-60P

60 V, P-channel Trench MOSFET

P-channel enhancement mode MOSFET in an LFPAK56 (Power SO8) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

This product has been designed and qualified to AEC-Q101 standard for use in high-performance automotive applications such as reverse battery protection.

Features and benefits

  • High thermal power dissipation capability

  • Suitable for thermally demanding environments due to 175 °C rating

  • Trench MOSFET technology

  • AEC-Q101 qualified

Applications

  • Reverse battery protection

  • Power management

  • High-side load switch

  • Motor drive

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) RDSon [max] @ VGS = 4.5 V (mΩ) Tj [max] (°C) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
BUK6Y61-60P SOT669 LFPAK56; Power-SO8 Production P 1 -60 61 93 175 4.2999997 20 66 37 -2 Y 1060 85 2020-03-16

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BUK6Y61-60P BUK6Y61-60PX
(934661185115)
Active 6Y6160P SOT669
LFPAK56; Power-SO8
(SOT669)
SOT669 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT669_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BUK6Y61-60P BUK6Y61-60PX BUK6Y61-60P rohs rhf
品质及可靠性免责声明

文档 (18)

文件名称 标题 类型 日期
BUK6Y61-60P 60 V, P-channel Trench MOSFET Data sheet 2020-03-16
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90003 LFPAK MOSFET thermal design guide Application note 2023-08-22
SOT669 3D model for products with SOT669 package Design support 2017-06-30
SOT669 3D model for products with SOT669 package Design support 2017-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK56_POWER-SO8_SOT669_mk plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body Marcom graphics 2017-01-28
SOT669_115 LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation Packing information 2022-05-10
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BUK6Y61-60P BUK6Y61-60P SPICE model SPICE model 2020-04-01
BUK6Y61-60P BUK6Y61-60P Thermal model Thermal model 2020-08-12
BUK6Y61-60P_Cauer BUK6Y61-60P Cauer thermal model Thermal model 2020-08-12
BUK6Y61-60P_Foster BUK6Y61-60P Foster thermal model Thermal model 2020-08-12
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT669 3D model for products with SOT669 package Design support 2017-06-30
BUK6Y61-60P BUK6Y61-60P SPICE model SPICE model 2020-04-01
BUK6Y61-60P BUK6Y61-60P Thermal model Thermal model 2020-08-12
BUK6Y61-60P_Cauer BUK6Y61-60P Cauer thermal model Thermal model 2020-08-12
BUK6Y61-60P_Foster BUK6Y61-60P Foster thermal model Thermal model 2020-08-12
SOT669 3D model for products with SOT669 package Design support 2017-06-30

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BUK6Y61-60P BUK6Y61-60PX 934661185115 Active SOT669_115 1,500 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BUK6Y61-60P BUK6Y61-60PX 934661185115 SOT669 订单产品