NEVB-LOGIC04封装尺寸适配板
NEVB-LOGIC04 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
NEVB-LOGIC04封装尺寸适配板
主要特性与优势
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相关板块 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
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nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
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nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
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nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board |
相关板块 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
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nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board |
文档 (5)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |