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化学成分 BC817RAPN

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号封装封装说明总产品重量
BC817RAPNSOT1268-1DFN1412-62.42600 mg
12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
MSLPPTMPPTMSLPPTMPPT
934070166147312601235Dongguan, China; D-22529 HAMBURG, Germany 
次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
AdhesiveFillerSilver (Ag)7440-22-40.1064076.000004.38582
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0146610.470000.60420
Phenolic resinProprietary0.0189413.530000.78079
subTotal0.14000100.000005.77081
DieDoped siliconSilicon (Si)7440-21-30.05000100.000002.06101
subTotal0.05000100.000002.06101
DieDoped siliconSilicon (Si)7440-21-30.08000100.000003.29761
subTotal0.08000100.000003.29761
Lead FrameCopper alloyCopper (Cu)7440-50-80.9185195.6780037.86104
Magnesium (Mg)7439-95-40.001430.149200.05904
Nickel (Ni)7440-02-00.028642.983701.18069
Silicon (Si)7440-21-30.006210.646500.25583
Pure metal layerGold (Au)7440-57-50.000110.011400.00451
Nickel (Ni)7440-02-00.004760.495500.19608
Palladium (Pd)7440-05-30.000340.035700.01413
subTotal0.96000100.0000039.57132
Mould CompoundFillerSilica -amorphous-7631-86-90.2599023.0000010.71311
Silica fused60676-86-00.6780060.0000027.94724
Flame retardantMetal hydroxideProprietary0.033903.000001.39736
ImpurityBismuth (Bi)7440-69-90.005650.500000.23289
PigmentCarbon black1333-86-40.005650.500000.23289
PolymerEpoxy resin systemProprietary0.079107.000003.26051
Phenolic resinProprietary0.067806.000002.79472
subTotal1.13000100.0000046.57872
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000030.055500.00114
Tin solderTin (Sn)7440-31-50.0499799.940002.05977
subTotal0.05000100.000002.06100
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0160099.990000.65946
subTotal0.01600100.000000.65953
total2.42600100.00000100.00000
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