产品

探索Nexperia丰富的核心半导体产品组合，这些产品为全球几乎所有商用电子设计的基础功能提供支持——涵盖汽车、工业、移动及消费类应用领域。

所有产品

种类繁多的双极晶体管助您轻松满足系统需求。产品线涵盖基础双极晶体管模块，以及一系列节省空间和成本的带电阻晶体管，直至我们突破性的小信号系列低压降电压器件。

二极管

我们丰富的二极管产品组合为您提供当今市场所需的灵活性——无论是简单的齐纳二极管、高效的肖特基整流器、快速恢复二极管还是可控雪崩开关二极管。

ESD保护、TVS、信号调节

涵盖静电放电保护、瞬态电压抑制器件、共模扼流圈及电磁干扰滤波器，Nexperia的保护技术持续升级，在业界最小封装中提供最高级别的防护。

MOSFET

Nexperia提供种类丰富的低/中压（12-200 V）P沟道和N沟道硅MOSFET产品组合，采用多种节省空间且高效的封装方案。

SiC MOSFETs

Nexperia的1200V碳化硅（SiC）MOSFET重新定义了安全、稳健且可靠的电源开关标准，成为电动汽车充电基础设施、光伏逆变器及电机驱动领域的首选产品。
- 1200 V SiC MOSFETs

氮化镓场效应晶体管(GaN FET)

针对各类高压（650 V）和低压（40-150 V）应用场景，Nexperia氮化镓场效应晶体管凭借更低的导通损耗与开关损耗，实现了最快速的过渡/开关能力、最佳的功率效率以及更高的功率密度。

绝缘栅双极晶体管(IGBTs)

为满足高效高压电源转换和电机驱动日益增长的需求，Nexperia的IGBT采用坚固且经济高效的载流子存储沟槽栅极（CSTBT）先进场截止（FS）结构。
- 650 / 1200 V discrete IGBTs

模拟和逻辑IC

除全面的逻辑功能、模拟开关和I²C接口产品组合外，Nexperia还提供日益丰富的功率IC产品线，助力打造创新解决方案，专注于降低客户物料清单成本，提升系统效率与可靠性。
- 模拟
- 控制逻辑器件
- 接口
- 隔离
- 电源管理
- 电压转换器（电平转换器）

汽车

为助力实现互联电动及混合动力车辆，Nexperia半导体提供全系列符合AEC-Q100/Q101认证的器件，涵盖我们完整的产品组合，这些产品兼具高效能与高效设计特性。

应用

所有应用

秉承创新与可持续发展的理念，我们的组件在效率方面树立了行业标杆，助力全球客户为世界各地几乎所有商用电子设计开发节能高效的尖端解决方案

所有应用

汽车

当今汽车正经历着该行业有史以来最重大的变革。持续推进的电气化进程正引发从动力总成到云端系统的深刻变革，越来越多的电子功能被引入以提升安全性和舒适性。

工业和电力

从工业自动化到可再生能源及电动出行解决方案，Nexperia凭借久经考验的品质、稳定的大规模供应、终身可靠性与产品长寿命特性，助力工业持续运转。

移动和可穿戴应用

智能手机已牢牢扎根于我们的生活——它们是获取信息、社交联络、娱乐消遣以及银行服务到卡路里计算等全方位服务的不可或缺工具。但要实现这些功能，手机需要采用占用电路板空间小、能延长电池续航时间并支持复杂功能的组件。

计算和消费电子

当我们想到计算和消费类应用时，往往会联想到笔记本电脑和洗衣机。然而当今的应用已催生出一大批创新产品——从扫地机器人到自动充电遥控器。

子系统：电源转换拓扑结构

几乎所有电子设备都依赖某种形式的电源转换。无论是将交流电网电源转换为直流电源轨，提升直流电池电压，还是简单地处理当今电子系统中日益多样化的电源轨。

子系统

任何复杂系统均可分解为若干子系统，这些子系统可应用于众多领域。从电机驱动器和电源装置到用于稳定驱动LED灯串的恒流源，这些子系统之间的唯一区别在于其规格参数和整体效率。

参考设计

探索我们丰富的Nexperia参考设计及第三方评估板与参考设计系列。这些解决方案采用最先进的半导体技术，提供完整的系统、子系统及专业功能，可无缝集成至您的项目中。

全部参考设计

评估板

深入了解我们的产品如何为您的应用带来益处——无论是优化效率、增强稳健性还是提升可靠性，只需亲自尝试我们全面的评估板系列即可。

全部评估板

交互式应用说明

Nexperia交互式应用说明采用PartQuest Explore仿真技术，将传统书面应用说明赋予生动呈现。通过嵌入式仿真技术，为各类电源设计与拓扑结构提供指导方案，显著提升用户体验。

进阶辅助工具

Nexperia不仅致力于开发高性能功率产品和创新功率技术，更致力于打造最先进的工具，为设计工程师提供知识、学习资源和技术支持。

质量

支持

商店

工作机会

关于我们

新闻

博客

化学成分 GAN7R0-150LBE

作为一家积极进取的可持续发展公司，安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息，恩智浦可以向我们的客户提供相关资料，以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据，这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934665900328	GAN7R0-150LBEZ	GAN7R0-150LBE	SOT8073-1 (FCLGA)	RFS	3

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Contains intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1248 ppm; substance 65997-17-3: 16360 ppm; substance 7440-02-0: 5694 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1248 ppm; substance 7440-02-0: 5694 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 387 ppm; substance 7440-22-4: 25 ppm; substance 7440-57-5: 185 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	12.778950	98.545280	45.573985
Die	Wide-bandgap material	Gallium nitride (GaN)	25617-97-4	0.103740	0.800000	0.369971
Die	Metallisation	Aluminium (Al)	7429-90-5	0.084900	0.654720	0.302782
		Die Total		12.967590	100.000000	46.246738

Under Bump Metallization 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.000030	100.000000	0.000107
		Under Bump Metallization 1 Total		0.000030	100.000000	0.000107

Under Bump Metallization 2	Pure metal layer	Copper (Cu)	7440-50-8	0.000310	100.000000	0.001106
		Under Bump Metallization 2 Total		0.000310	100.000000	0.001106

Mould Compound	Filler	Silica fused	60676-86-0	2.957280	50.000000	10.546644
Mould Compound	Filler	Silica	7631-86-9	1.774370	30.000000	6.327993
Mould Compound	Polymer	Epoxy resin system		0.975910	16.500000	3.480420
Mould Compound	Polymer	Phenolic resin		0.177440	3.000000	0.632810
Mould Compound	Pigment	Carbon black	1333-86-4	0.029570	0.500000	0.105456
		Mould Compound Total		5.914570	100.000000	21.093323

Passivation	Polymer	Polyimide resin		0.131020	94.000150	0.467261
Passivation	Additive	Non-declarable		0.008360	5.999850	0.029814
		Passivation Total		0.139380	100.000000	0.497075

Redistribution Layer	Pure metal layer	Copper (Cu)	7440-50-8	0.346900	100.000000	1.237161
		Redistribution Layer Total		0.346900	100.000000	1.237161

Solder Bump 1	Pure metal layer	Copper (Cu)	7440-50-8	0.452700	100.000000	1.614479
		Solder Bump 1 Total		0.452700	100.000000	1.614479

Solder Bump 2	Pure metal layer	Nickel (Ni)	7440-02-0	0.010030	100.000000	0.035770
		Solder Bump 2 Total		0.010030	100.000000	0.035770

Solder Bump 3	Tin alloy	Tin (Sn)	7440-31-5	0.038280	98.204210	0.136519
Solder Bump 3	Tin alloy	Silver (Ag)	7440-22-4	0.000700	1.795790	0.002497
		Solder Bump 3 Total		0.038980	100.000000	0.139016

Substrate/Laminate	Copper alloy	Copper (Cu)	7440-50-8	5.496710	73.393690	19.603096
Substrate/Laminate	Copper alloy	Phosphorus (P)	7723-14-0	0.001390	0.018560	0.004957
		Plating 2 Total		5.498100	73.412250	19.608053
Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.149640	1.998040	0.533666
		Plating 3 Total		0.149640	1.998040	0.533666
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.010850	0.144870	0.038695
		Plating 4 Total		0.010850	0.144870	0.038695
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.005200	0.069430	0.018545
		Plating 5 Total		0.005200	0.069430	0.018545
Substrate/Laminate	Filler	Silica	7631-86-9	0.688510	9.193190	2.455456
Substrate/Laminate	Filler	Glass, oxide, chemicals (fibrous)	65997-17-3	0.458740	6.125230	1.636019
Substrate/Laminate	Polymer	Epoxy resin system		0.228970	3.057270	0.816583
Substrate/Laminate	Polymer	Cyanate ester resin		0.152380	2.034620	0.543438
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000480	0.006410	0.001712
Substrate/Laminate	Impurity	Misc. fluorine compounds (generic)		0.000130	0.001740	0.000464
		Pre-preg Total		1.529210	20.418460	5.453672
Substrate/Laminate	Polymer	Acrylate Polymer		0.130690	1.745010	0.466084
Substrate/Laminate	Filler	Barium sulfate (BaSO4)	7727-43-7	0.086240	1.151500	0.307560
Substrate/Laminate	Polymer	Epoxy resin system		0.058080	0.775500	0.207132
Substrate/Laminate	Additive	Non-declarable		0.008890	0.118700	0.031705
Substrate/Laminate	Filler	Talc	14807-96-6	0.008890	0.118700	0.031705
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.001780	0.023770	0.006348
Substrate/Laminate	Additive	Silica	7631-86-9	0.001780	0.023770	0.006348
		Solder Mask Total		0.296350	3.956950	1.056882
		Substrate/Laminate Total		7.489350	100.000000	26.709513

Underfill	Filler	Silica fused	60676-86-0	0.439380	64.597820	1.566975
Underfill	Polymer	Formaldehyde, polymer with (chloromethyl)oxirane and phenol	9003-36-5	0.213420	31.377820	0.761127
Underfill	Additive	Non-declarable		0.021760	3.199410	0.077603
Underfill	Pigment	Carbon black	1333-86-4	0.005440	0.799840	0.019401
Underfill	Impurity	Misc. chlorine compounds (generic)		0.000130	0.019090	0.000463
Underfill	Additive	Polysiloxanes, Me 3,3,3-trifluoropropyl	63148-56-1	0.000040	0.006020	0.000143
		Underfill Total		0.680170	100.000000	2.425712

		GAN7R0-150LBE Total		28.040010		100.000000

Notes
Report created on 2026-01-19 19:12:25 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2026-01-19 19:12:25 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Component	有毒有害物质或元素 (Toxic and hazardous substances or elements)
部件名称 Component	Pb (铅) 铅 Lead	Hg (汞) 汞 Mercury	Cd (镉) 镉 Cadmium	Cr⁶⁺ (六价铬) 六价铬 Chromium VI	PBB (多溴联苯) 多溴联苯 Polybrominated biphenyls	PBDE (多溴二苯醚) 多溴二苯醚 Polybrominated diphenyl ethers	DEHP (邻苯二甲酸二(2-乙基己)酯) 邻苯二甲酸二(2-乙基己)酯 Di(2-ethylhexyl) phthalate	BBP (邻苯二甲酸丁苄酯) 邻苯二甲酸丁苄酯 Butyl benzyl phthalate	DBP (邻苯二甲酸二丁酯) 邻苯二甲酸二丁酯 Dibutyl phthalate	DIBP (邻苯二甲酸二异丁酯) 邻苯二甲酸二异丁酯 Diisobutyl phthalate
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部金属层 (Under Bump Metallization)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部金属层 (Under Bump Metallization)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
钝化层 (Passivation)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
重布层 (Redistribution Layer)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
焊锡凸块 (Solder Bump)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
焊锡凸块 (Solder Bump)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
焊锡凸块 (Solder Bump)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层2 (Plating 2)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层3 (Plating 3)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层4 (Plating 4)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层5 (Plating 5)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
黏合胶片 (Pre-preg)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
防焊绿漆 (Solder Mask)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部填充料 (Underfill)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件的所有均质材料中的含量均符合 GB/T 26572 规定的限量要求。 Indicates that the content of the hazardous substance in all homogeneous materials of this part complies with the limit requirements of GB/T 26572.
✕	表示该有害物质在该部件的至少一种均质材料中的含量超过 GB/T 26572 规定的限量要求（如适用，符合相关豁免要求）。 Indicates that the content of the hazardous substance in at least one homogeneous material of this part exceeds the limit requirements of GB/T 26572 (where applicable, in accordance with relevant exemptions).
	该半导体产品符合中国 RoHS 要求，适用"e"标识，环境保护使用期限（EFUP）标识不适用。 This semiconductor product complies with China RoHS requirements and bears the "e" mark; therefore, the Environmental Friendly Use Period (EFUP) marking is not applicable. 注：EFUP 的确定基于产品在正常使用条件下的环境与可靠性评估。 Note: The EFUP is determined based on environmental and reliability assessments under normal operating conditions.

Notes
Report created on 2026-01-19 19:12:25 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

化学成分 GAN7R0-150LBE