双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

SiC power devices

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

SOT1226

SOT1226

plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT1226 X2SON5 plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body 2012-04-18

Boards

Part number Description Type Quick links Shop link
描述
NEVB-LOGIC05 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
类型
Evaluation board
Quick links
Shop link

相关文档

文件名称 标题 类型 日期
AN90063 Questions about package outline drawings Application note 2025-10-22
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
X2SON5_SOT1226_mk plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body Marcom graphics 2017-01-28
REFLOW_BG-BD-1 Reflow soldering profile Other type 2026-02-10
SOT1226 plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body Package information 2022-05-30
SOT1226C_147 X2SON5; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or Z Ordering code (12NC) ending 147 Packing information 2020-04-27
SOT1226_125 X2SON5; Reel pack for SMD, 7''; Q3/T4 product orientation Packing information 2020-04-21
MAR_SOT1226 MAR_SOT1226 Topmark Top marking 2013-06-03

采用此封装的产品

Analog & Logic ICs

型号 描述 快速访问