外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT883-3 | DFN1006-3 | Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.46 mm | 2021-08-23 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT883-3 | 3D model for products with SOT883-3 package | Design support | 2023-03-13 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Other type | 2026-02-10 |
| SOT883-3 | Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.46 mm | Package information | 2022-05-20 |
采用此封装的产品
ESD protection, TVS, filtering and signal conditioning
| 型号 | 描述 | 快速访问 |
|---|---|---|
| PESD4V0X2UM | Extremely low capacitance unidirectional ESD protection diode array |