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SOT552-1

SOT552-1

plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body

外形图

封装版本	封装名称	封装说明	参考	发行日期
SOT552-1	TSSOP10	plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body		2003-02-18

相关文档

文件名称	标题	类型	日期
Nexperia_document_guide_MiniLogic_PicoGate_201901	PicoGate leaded logic portfolio guide	Brochure	2019-01-07
SOT552-1	3D model for products with SOT552-1 package	Design support	2020-01-22
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
TSSOP10_SOT552_mk	plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body	Marcom graphics	2017-01-28
SOT552-1	plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body	Package information	2022-06-07
SOT552-1_118	TSSOP10; Reel pack for SMD, 13''; Q1/T1 product orientation	Packing information	2020-04-21
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08

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