外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT1116 | XSON8 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | 2010-04-07 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
SOT1116_115 | XSON8 ; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
采用此封装的产品
Analog & Logic ICs
型号 | 描述 | 快速访问 |
---|---|---|
74LVC1G53GN | 2-channel analog multiplexer/demultiplexer |
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