外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT8018 | D2PAK R2P | Plastic, single-ended surface-mounted package (D2PAK R2P); Real-2-Pin configuration; 5.08 mm pitch; 8.8 mm x 10.35 mm x 4.46 mm body | TO-263 (JEDEC) | 2024-01-17 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT8018 | 3D model for products with SOT8018 package | Design support | 2023-03-13 |
SOT8018 | Plastic, single-ended surface-mounted package (D2PAK R2P); Real-2-Pin configuration; 5.08 mm pitch; 8.8 mm x 10.35 mm x 4.46 mm body | Package information | 2024-05-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |