- 框图
- Design considerations
- Product listing
- Design resources
- 支持
框图
Power interface
推荐产品 (4)
Related sub-systems (1)
Power management
Load management
推荐产品 (6)
- MOSFET: N-Channel, 40-100 V, Rdson < 15 mΩ; Leaded and micro leaded
- Gate driver: Half bridge up to 120 V
- Gate driver: High frequency dual channel
- Relay replacement: ≤ 100 V PNP or NPN Single bipolar transistors, good cooling, large package relay replacement
- Tracking LDO: Wide Vin / Vout, full diagnostic and protection, up to 300 mA per channel
- Schottky diode: 40-100 V, CFP2-HP / CFP3 / CFP5
Signal control
Communications interface
Control modules
Related systems (2)
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Design considerations
- Requires scalable and flexible product families tailored to BCU communication interfaces and output options for load management
- Discrete and integrated solutions for protection, power conversion and power management
- Rugged and robust packages (LFPAK and CFP packages) further support space saving, thermal efficiency and high reliability levels
- ESD protection qualified and tested to the latest standards for high-speed communication networks between the BCU and other vehicle subsystem controllers
- Small signal discrete and logic devices provide additional safety features independent of the main processor
Product listing
Power interface
Power management
Load management
- MOSFET: N-Channel, 40-100 V, Rdson < 15 mΩ; Leaded and micro leaded
- Gate driver: Half bridge up to 120 V
- Gate driver: High frequency dual channel
- Relay replacement: ≤ 100 V PNP or NPN Single bipolar transistors, good cooling, large package relay replacement
- Tracking LDO: Wide Vin / Vout, full diagnostic and protection, up to 300 mA per channel
- Schottky diode: 40-100 V, CFP2-HP / CFP3 / CFP5
Signal control
Communications interface
Design resources
Evaluation boards