双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

SiC power devices

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

SOT8041-2

SOT8041-2

Plastic thermal enhanced very very thin Quad Flat package, no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT8041-2 HWQFN24 Plastic thermal enhanced very very thin Quad Flat package, no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body 2024-12-16

Boards

Part number Description Type Quick links Shop link
描述
NEVB-LOGIC05 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
类型
Evaluation board
Quick links
Shop link

相关文档

文件名称 标题 类型 日期
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT8041-2 Plastic thermal enhanced very very thin Quad Flat package,no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body Package information 2025-03-18
SOT8041-2_518 HWQFN24; Reel dry pack for SMD, 13"; Q1/T1 product orientation Packing information 2025-01-27

采用此封装的产品

Analog & Logic ICs

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