双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)
IP4264CZ8-10-TTL

IP4264CZ8-10-TTL End of life

Integrated (U)SIM card passive filter array with ESD protection

The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to ±25 kV contact and higher than ±25 kV air discharge, far exceeding IEC 61000-4-2, level 4.

The devices support ESD protection of the USB data pins of a Universal Subscriber Identity Module (USIM) interface, as well as the digital standard SIM interface ESD protection and ElectroMagnetic Interface (EMI) filtering.

The devices are fabricated using monolithic silicon technology. They integrate three resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all three devices ideal for use in applications requiring component miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices.

Similar products are available in Wafer Level Chip-Size Package (WLCSP). IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces. IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces.
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产品细节

Features and benefits

  • Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)
  • 3-channel SIM card interface integrated RC-filter array and SIM voltage ESD protection
  • 2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance
  • Integrated 100 Ω/100 Ω/47 Ω series channel resistors
  • Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL) or 40 pF (IP4264CZ8-40-TTL)
  • Downstream ESD protection up to ±25 kV (contact) according to IEC 61000-4-2
  • Micropak (QFN compatible) plastic package with 0.4 mm pitch

Applications

  • SIM interfaces in for example, cellular phone and Personal Communication System (PCS) mobile handsets

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Longevity

The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.

交互式数据手册

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册