74LVC1G16-Q100

Single buffer

The 74LVC1G16-Q100 provides a low-power, low-voltage single buffer.

The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I_OFF. The I_OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

Automotive product qualification in accordance with AEC-Q100 (Grade 1)
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant inputs for interfacing with 5 V logic
High noise immunity
±24 mA output drive (V_CC = 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Complies with JEDEC standard:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8-B/JESD36 (2.7 V to 3.6 V).
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74LVC1G16GW-Q100	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	1	low	-40~125	319	88.0	188	TSSOP5

封装

型号	封装	尺寸版本	回流焊/波峰焊	包装	状态	标示	可订购的器件编号，（订购码(12NC)）
74LVC1G16GW-Q100	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	SOT353-1_125	Active	Yr	74LVC1G16GW-Q100H ( 9356 912 03125 )

环境信息

型号	可订购的器件编号	化学成分	RoHS	RHF指示符	无铅转换日期
74LVC1G16GW-Q100	74LVC1G16GW-Q100H	74LVC1G16GW-Q100

品质及可靠性免责声明

文档 (4)

文件名称	标题	类型	日期
74LVC1G16_Q100	Single buffer	Data sheet	2023-08-15
lvc1g16	74LVC1G16 IBIS model	IBIS model	2015-10-29
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-11-15

支持

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模型

文件名称	标题	类型	日期
lvc1g16	74LVC1G16 IBIS model	IBIS model	2015-10-29

订购、定价与供货

74LVC1G16GW-Q100

样品

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