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74HC259-Q100; 74HCT259-Q100

8-bit addressable latch

The 74HC259-Q100; 74HCT259-Q100 is an 8-bit addressable latch. The device features four modes of operation. In the addressable latch mode, data on the D input is written into the latch addressed by the inputs A0 to A3. The addressed latch will follow the data input, non-addressed latches will retain their previous states. In memory mode, all latches retain their previous states and are unaffected by the data or address inputs. In the 3-to-8 decoding or demultiplexing mode, the addressed output follows the D input and all other outputs are LOW. In the reset mode, all outputs are forced LOW and unaffected by the data or address inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8C (2.7 V to 3.6 V)
    • JESD7A (2.0 V to 6.0 V)

  • Combined demultiplexer and 8-bit latch

  • Serial-to-parallel capability

  • Output from each storage bit available

  • Random (addressable) data entry

  • Easily expandable

  • Common reset input

  • Useful as a 3-to-8 active HIGH decoder

  • Input levels:

    • For 74HC259-Q100: CMOS level

    • For 74HCT259-Q100: TTL level

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74HC259BQ-Q100Production2.0 - 6.0CMOS± 5.2188low-40~1258910.857DHVQFN16
74HC259D-Q100Production2.0 - 6.0CMOS± 5.2188low-40~125887.747SO16
74HC259PW-Q100Production2.0 - 6.0CMOS± 5.2188low-40~1251213.649.9TSSOP16
74HCT259BQ-Q100Production4.5 - 5.5TTL± 4208low-40~1258910.857DHVQFN16
74HCT259D-Q100Production4.5 - 5.5TTL± 4208low-40~125887.747SO16
74HCT259PW-Q100Production4.5 - 5.5TTL± 4208low-40~1251213.649.9TSSOP16

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74HC259BQ-Q100
DHVQFN16
(SOT763-1) 		SOT763-1SOT763-1_115ActiveHC25974HC259BQ-Q100,115
( 9352 988 21115 )
74HC259D-Q100
SO16
(SOT109-1) 		SOT109-1SO-SOJ-REFLOW
SO-SOJ-WAVE
SOT109-1_118Active74HC259D74HC259D-Q100,118
( 9352 988 22118 )
74HC259PW-Q100
TSSOP16
(SOT403-1) 		SOT403-1SSOP-TSSOP-VSO-WAVE
SOT403-1_118ActiveHC25974HC259PW-Q100,118
( 9352 988 23118 )
74HCT259BQ-Q100
DHVQFN16
(SOT763-1) 		SOT763-1SOT763-1_115ActiveHCT25974HCT259BQ-Q100,11
( 9352 988 24115 )
74HCT259D-Q100
SO16
(SOT109-1) 		SOT109-1SO-SOJ-REFLOW
SO-SOJ-WAVE
SOT109-1_118Active74HCT259D74HCT259D-Q100,118
( 9352 988 25118 )
74HCT259PW-Q100
TSSOP16
(SOT403-1) 		SOT403-1SSOP-TSSOP-VSO-WAVE
SOT403-1_118ActiveHCT25974HCT259PW-Q100,11
( 9352 988 26118 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74HC259BQ-Q10074HC259BQ-Q100,11574HC259BQ-Q100Always Pb-free
74HC259D-Q10074HC259D-Q100,11874HC259D-Q100Always Pb-free
74HC259PW-Q10074HC259PW-Q100,11874HC259PW-Q100Always Pb-free
74HCT259BQ-Q10074HCT259BQ-Q100,1174HCT259BQ-Q100Always Pb-free
74HCT259D-Q10074HCT259D-Q100,11874HCT259D-Q100Always Pb-free
74HCT259PW-Q10074HCT259PW-Q100,1174HCT259PW-Q100Always Pb-free
品质及可靠性免责声明

文档 (12)

文件名称标题类型日期
74HC_HCT259_Q1008-bit addressable latchData sheet2024-03-11
AN11044Pin FMEA 74HC/74HCT familyApplication note2019-01-09
hc25974HC259 IBIS modelIBIS model2022-10-21
hct25974HCT259 IBIS modelIBIS model2022-10-21
HCT_USER_GUIDEHC/T User GuideUser manual1997-10-31
SOT763-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm bodyPackage information2023-05-11
SO-SOJ-WAVEFootprint for wave solderingWave soldering2009-10-08
SO-SOJ-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT109-1plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm bodyPackage information2023-11-07
SOT403-1plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm bodyPackage information2023-11-08
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08

支持

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模型

文件名称标题类型日期
hc25974HC259 IBIS modelIBIS model2022-10-21
hct25974HCT259 IBIS modelIBIS model2022-10-21

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