双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

Fundamentals of ESD protection in Electronic Designs

About the webinar

This on-demand webinar offers a comprehensive introduction to Electrostatic Discharge (ESD) protection in electronic designs. It covers essential industry standards and testing methods, providing a strong foundation for understanding how to safeguard electronic components from ESD-related damage.

It explores the Transmission Line Pulse (TLP) characterization method and its practical applications, examines various ESD protection technologies and their unique behaviors, and explains the importance of key datasheet parameters. To support effective implementation, the webinar also shares practical tips on PCB layout and routing techniques that enhance ESD protection.

As part of a broader series, this recording sets the stage for upcoming webinars that will take a deeper look into Ethernet for automotive ESD protection and the latest advancements in Flip-Chip package technology.

Key take aways

  • Understand the differences and ensure compliance of ESD standards
  • Explore various ESD testing methods
  • Discover the practical benefits of TLP characterization
  • Learn about typical characteristics of protection technologies
  • Master the interpretation of key specs in datasheets
  • Get PCB layout tips for optimized ESD protection and signal integrity

Presenters

  • Taimoor Ahmed, Product Manager Bipolar Discretes at Nexperia
  • Dr. Andreas Hardock, Senior Principal Product Application Engineer at Nexperia
  • Martin Pilaski, Product Application Engineer at Nexperia