×

PSMN1R1-30YLE

N-channel 30 V, 1.3 mOhm, ASFET for hotswap with enhanced SOA in LFPAK56

N-channel enhancement mode ASFET for hotswap with enhanced SOA in LFPAK56 package optimized for low RDSon and strong safe operating area, optimized for hot-swap, inrush and linear-mode applications.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PSMN1R1-30YLE PSMN1R1-30YLEX 934664064115 SOT669 订单产品

特性

  • Fully optimized Safe Operating Area (SOA) for superior linear mode operation

  • Optimized for low RDSon / low I²R conduction losses

  • LFPAK56 package for applications that demand the highest performance and reliability in a 30 mm² footprint

  • Low leakage <1 µA at 25 °C

  • Copper-clip for low parasitic inductance and resistance

  • High reliability LFPAK package, qualified to 175 °C

目标应用

  • Hot swap in 12 V - 20 V applications

  • e-Fuse

  • DC switch

  • Load switch

  • Battery protection

参数类型

型号Package versionPackage nameProduct statusChannel typeNr of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)QG(tot) [typ] @ VGS = 10 V (nC)Ptot [max] (W)Qr [typ] (nC)VGSth [typ] (V)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)ISOA [max] @ tp = 1 ms (A)ISOA [max] @ tp = 10 ms (A)ISOA [max] @ tp = 100 ms (A)Date
PSMN1R1-30YLESOT669LFPAK56; Power-SO8ProductionN1301.2617526592862192231.87N4211169936.7413.19.682022-09-19

PCB Symbol, Footprint and 3D Model

Model Name描述

Package

型号可订购的器件编号,(订购码(12NC))状态标示封装尺寸版本回流焊/波峰焊包装
PSMN1R1-30YLEPSMN1R1-30YLEX
( 9346 640 64115 )
Active1E1L30Y
LFPAK56; Power-SO8
(SOT669)
SOT669REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT669_115

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符
PSMN1R1-30YLEPSMN1R1-30YLEXPSMN1R1-30YLE
品质及可靠性免责声明

文档 (14)

文件名称标题类型日期
PSMN1R1-30YLEN-channel 30 V, 1.3 mOhm, ASFET for hotswap with enhanced SOA in LFPAK56Data sheet2022-11-10
AN90016Maximum continuous currents in NEXPERIA LFPAK power MOSFETsApplication note2020-09-03
AN50006Power MOSFETs in linear modeApplication note2022-04-12
SOT6693D model for products with SOT669 packageDesign support2017-06-30
Reliability_information_t11_sot669Reliability qualification informationQuality document2022-08-19
T11_SOT669_PSMN1R1-30YLE_Nexperia_Quality_documentProduct Quality Quick Reference InformationQuality document2022-10-31
PSMN1R1-30YLEPSMN1R1-30YLE SPICE modelSPICE model2022-10-24
CauerModel_PSMN1R1-30YLECauer model PSMN1R1-30YLEThermal model2022-10-24
FosterModel_PSMN1R1-30YLEFoster model PSMN1R1-30YLEThermal model2022-10-24
PSMN1R1-30YLEPSMN1R1-30YLE RC thermal modelThermal model2022-10-24
PSMN1R1-30YLEPSMN1R1-30YLE FloTherm thermal modelThermal model2022-10-24
SOT669_115LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientationPacking information2022-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
SOT6693D model for products with SOT669 packageDesign support2017-06-30
PSMN1R1-30YLEPSMN1R1-30YLE SPICE modelSPICE model2022-10-24
CauerModel_PSMN1R1-30YLECauer model PSMN1R1-30YLEThermal model2022-10-24
FosterModel_PSMN1R1-30YLEFoster model PSMN1R1-30YLEThermal model2022-10-24
PSMN1R1-30YLEPSMN1R1-30YLE RC thermal modelThermal model2022-10-24
PSMN1R1-30YLEPSMN1R1-30YLE FloTherm thermal modelThermal model2022-10-24

PCB Symbol, Footprint and 3D Model

Model Name描述

订购、定价与供货

型号Orderable part numberOrdering code (12NC)包装Packing quantity在线购买
PSMN1R1-30YLEPSMN1R1-30YLEX934664064115SOT669_115- 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.