Celebrating 20 years of LFPAK

Two decades ago, Nexperia transformed the semiconductor industry with a unique clip-bond package for power MOSFETs, this disruptive innovation was called LFPAK. It was revolutionary, offering radical performance improvements that gave early adopters more than they dared hope for in a MOSFET ...
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Join Nexperia Energy Harvesting Solutions, powered by Nowi Technology at Embedded World

March 14-16, 2023
Nuremberg, Germany
4-570 in Hall 4 (IC & Design Area)
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Nexperia launches new hotswap Application Specific MOSFETs (ASFETs) with double the improvement in SOA

Fully optimised RDS(on) & SOA manage in-rush currents in 12 V hotswap and soft start applications.
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Nexperia Bolsters its Range of CFP Power Diodes

Ongoing growth in clip-bonded FlatPower (CFP) manufacturing capacity and portfolio serves increasing demand from modern automotive and industrial applications.
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助力工业和电力应用持续运行

Nexperia可满足工业和电力客户的需求,提供经过验证的品质和稳定的大批量供应,产品持久耐用且可靠。Nexperia每年生产的产品超过1000亿件,涵盖广泛的产品和封装组合,助力工业和电力行业持续发展。欢迎在Nexperia这里获取适合您的应用设计和产品推荐。
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汽车应用设计

当今的汽车正在经历行业有史以来最重大的变革。持续电气化导致从引擎到云系统发生显著变化。欢迎在Nexperia这里获取适合您的应用设计和产品推荐。
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为半导体制造公司ITEC寻找杰出人才

当前我们正在招募多个关键角色,以扩展ITEC团队的能力。我们需要机电一体化、电子或研发方面真正的专家,助我们开发新一代机器。
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