当今的汽车正在经历行业有史以来最重大的变革。持续电气化导致从引擎到云系统发生显著变化。欢迎在Nexperia这里获取适合您的应用设计和产品推荐。

二十年前，Nexperia凭借独具特色的有引脚夹片粘合功率MOSFET一举改变了半导体行业。这项突破性的创新技术名为LFPAK，比市场上任何类型的封装都能实现更低的功率损耗。LFPAK具有革新性，大幅度地改进了性能，为早期采用者所带来的优势超出了他们对MOSFET封装的预期。

Nexperia is proud to announce the launch of e-mode GaN FETs for low (100/150 V) and high (650 V) voltage applications. By augmenting its cascode offering with seven new e-mode devices, Nexperia now provides designers with the optimum choice of GaN FETs from a single supplier alongside its ...

Nijmegen -- Additional 40% lower RDS(on) and increase power density by 58x for telecom & computing hot-swap computing applications

Nijmegen -- Merged PiN Schottky structure delivers maximum robustness and efficiency

Nexperia可满足工业和电力客户的需求，提供经过验证的品质和稳定的大批量供应，产品持久耐用且可靠。Nexperia每年生产的产品超过1000亿件，涵盖广泛的产品和封装组合，助力工业和电力行业持续发展。欢迎在Nexperia这里获取适合您的应用设计和产品推荐。

当前我们正在招募多个关键角色，以扩展ITEC团队的能力。我们需要机电一体化、电子或研发方面真正的专家，助我们开发新一代机器。

Nexperia proudly presents its energy harvesting solutions in Mouser Electronics and EE Journal’s latest Chalk Talk. Find out more about how to design in energy harvesting and why Nexperia’s inductorless PMICs are a game changer for wearable and sensor applications.