6,000+ 0 汽车应用认证产品 我们为互联汽车提供专用分立器件、MOSFET器件和逻辑器件，产品完全符合AEC-Q100/Q101标准。
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200+ 0 封装 您可在这里查找并订购合适的封装，我们广泛的封装系列可为您提供灵活自由的设计空间。 阅读更多
21,000+ 0 文档 这里提供完整的技术和支持文档库，从数据表和应用笔记到使用手册，涵盖多种内容。 阅读更多
100+ 0 职位 Nexperia是一家专注于半导体开发和自有生产的全球知名公司。我们提供众多职位，让员工可以获得职业发展，迎接富有意义的挑战。 阅读更多

Nexperia in the Spotlight at football match N.E.C. – AZ

Nexperia, a semiconductor manufacturer headquartered in Nijmegen, is the main partner of football club N.E.C. from Nijmegen. Today, Nexperia will be in the spotlight during the N.E.C. match in the Goffert stadium.
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Expanded GaN FET portfolio now supports a wider range of power requirements in low and high voltage applications

Nexperia expands its e-mode GaN FET portfolio with 12 new devices, addressing the demand for higher efficiency and compact systems. Supporting consumer, industrial, computing, and telecom markets, Nexperia remains the only supplier offering cascode, d-mode, and e-mode solutions for design ...
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CCPAK1212 package pushes the performance of power MOSFETs to the next level

Introducing 16 new 80 V and 100 V power MOSFETs in the CCPAK1212 package, offering industry-leading power density and performance. The copper-clip design ensures high current conduction, low inductance, and excellent thermal performance, ideal for motor control, power supplies, and renewable ...
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Expanded power device portfolio now includes standard & automotive qualified ideal diodes

The NID5100 is suitable for standard industrial & consumer applications while the NID5100-Q100 has been qualified for use in automotive applications. Ideal diodes are MOSFET based devices that offer much lower forward voltage drop than traditional diodes and make the perfect replacement ...
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Ensuring reliability for your cobot design

The collaborative robot industry is reshaping standards in performance, safety and efficiency. Choosing the right products is key to minimizing downtime and ensuring maximum performance. Select the ideal MOSFET for your BLDC motor application with our selector tool and get your free samples.
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Enabling robotics innovation: A Nexperia Success Story

Find out how our partnership with Synapticon enables the revolution of servo drives for cobots and robotic machines, ensuring continuous innovation and reliability.
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快速体验|安世半导体第三代半导体样品大放送

安世半导体官方商城提供最新上市的第三代半导体样品申请，涵盖碳化硅（SiC）和氮化镓（GaN）等多种类型。无论您需要哪种类型的半导体产品，我们都可以为您提供高质量的样品服务。

点击“阅读更多”立即免费申请安世第三代半导体样品！
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First Silicon Carbide (SiC) MOSFETs released

Addressing the growing demand for high-power and high-voltage
industrial applications, Nexperia releases its first Silicon Carbide (SiC) MOSFETs for safe, robust and reliable power switching.
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节省PCB空间，探索如何构建面向未来的设计

访问该专题页面，深入了解适用于二极管和晶体管的DFN和CFP封装，既节省空间，还能提高热效率。了解推动封装转型的因素、如何优化热性能并确保封装稳健可靠。
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First family of IGBTs released

With demand increasing for robust and efficient high-voltage power semiconductors, Nexperia releases its first family of IGBTs with a selection of 650 V devices for industrial applications.
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庆祝LFPAK问世20周年！

二十年前，Nexperia凭借独具特色的有引脚夹片粘合功率MOSFET一举改变了半导体行业。这项突破性的创新技术名为LFPAK，比市场上任何类型的封装都能实现更低的功率损耗。LFPAK具有革新性，大幅度地改进了性能，为早期采用者所带来的优势超出了他们对MOSFET封装的预期。

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助力工业和电力应用持续运行

Nexperia可满足工业和电力客户的需求，提供经过验证的品质和稳定的大批量供应，产品持久耐用且可靠。Nexperia每年生产的产品超过1000亿件，涵盖广泛的产品和封装组合，助力工业和电力行业持续发展。欢迎在Nexperia这里获取适合您的应用设计和产品推荐。
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为半导体制造公司ITEC寻找杰出人才

当前我们正在招募多个关键角色，以扩展ITEC团队的能力。我们需要机电一体化、电子或研发方面真正的专家，助我们开发新一代机器。
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最新新闻及BLOG

  • 博客文章
4月 23, 2025

Optimized power switching for high-volume applications

When it comes to selecting a MOSFET, the headline figure most engineers look for is the RDS(on) ...
  • 博客文章
4月 17, 2025

Powerful insights into ADAS sensor systems

Advanced Driver Assistance Systems (ADAS) play an increasingly central role in ensuring road ...
  • 新闻稿
4月 11, 2025

哈佛中国论坛灼见丨安世半导体董事长张学政出席，以全球化视野共话AI时代新机遇

4月4日至6日，第28届哈佛大学中国论坛成功举办。安世半导体董事长兼CEO张学政受邀出席，并在“智能时代的变革与未来”分论坛上发表精彩观点，与行业领袖共同探讨全球化、技术迭代与社会责任等议题， ...
  • 博客文章
4月 9, 2025

The Future of ESD Protection: Unveiling the ...
  • 博客文章
4月 9, 2025

Why Flip-Chip LGA is a Game Changer for RF ESD ...

As application speeds keep increasing, it is crucial for designers to source devices that can ...
  • 新闻稿
4月 9, 2025

Nexperia推出专为汽车ESD保护优化的全新高速倒装芯片封装技术

全新倒装芯片栅格阵列(FC-LGA)封装提供出色的射频性能，采用侧边可湿焊盘，满足车规级质量要求
效率致胜blog 阅读所有新闻稿

Accelerating automotive electrification

Electrification continues to transform the way we use and interact with our cars. While the most obvious changes are in the drive train (full battery or plug-in hybrid), the impact can be seen in every aspect of automotive electronics, improving safety and efficiency of all e-mobility options.

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Accelerating automotive electrification

Powering an industrial revolution

With the Internet of Things (IoT) and Industry 4.0, the industrial environment is changing constantly towards energy efficiency, power miniaturization and system reliability. That requires highly efficient Uninterruptible Power Supply (UPS) and smaller, more powerful motor drives for everything from collaborative robots (cobots) to industrial equipment and electric forklift trucks.

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Powering an industrial revolution

Nexperia 2023年可持续发展报告

Nexperia 现推出 2023 年可持续发展报告。点击下方以阅读更多。

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