型号 | 封装 | 封装说明 | 总产品重量 |
---|---|---|---|
74ALVCH16952DGG | SOT364-1 | TSSOP56 | 233.10028 mg |
次组件 | 材料组 | 物质 | CAS登录号 | 重量(毫克) | 次组件重量(%) | 总产品重量(%) |
---|---|---|---|---|---|---|
Adhesive | Filler | Silver (Ag) | 7440-22-4 | 0.19475 | 77.90000 | 0.08355 |
Polymer | Acrylic resin | Proprietary | 0.03800 | 15.20000 | 0.01630 | |
Resin system | Proprietary | 0.01725 | 6.90000 | 0.00740 | ||
subTotal | 0.25000 | 100.00000 | 0.10725 | |||
Die | Doped silicon | Silicon (Si) | 7440-21-3 | 3.15233 | 100.00000 | 1.35235 |
subTotal | 3.15233 | 100.00000 | 1.35235 | |||
Lead Frame | Copper alloy | Copper (Cu) | 7440-50-8 | 87.72759 | 94.58500 | 37.63513 |
Magnesium (Mg) | 7439-95-4 | 0.15953 | 0.17200 | 0.06844 | ||
Silicon (Si) | 7440-21-3 | 0.66084 | 0.71250 | 0.28350 | ||
Pure metal layer | Gold (Au) | 7440-57-5 | 0.02736 | 0.02950 | 0.01174 | |
Nickel (Ni) | 7440-02-0 | 4.10929 | 4.43050 | 1.76288 | ||
Palladium (Pd) | 7440-05-3 | 0.04545 | 0.04900 | 0.01950 | ||
Silver (Ag) | 7440-22-4 | 0.01994 | 0.02150 | 0.00855 | ||
subTotal | 92.75000 | 100.00000 | 39.78974 | |||
Mould Compound | Additive | Non hazardous | Proprietary | 6.40610 | 4.70000 | 2.74822 |
Filler | Silica fused | 60676-86-0 | 107.67700 | 79.00000 | 46.19342 | |
Flame retardant | Magnesium Hydroxide (Mg(OH)2) | 1309-42-8 | 8.17800 | 6.00000 | 3.50836 | |
Pigment | Carbon black | 1333-86-4 | 0.27260 | 0.20000 | 0.11695 | |
Polymer | 1,4-Bis(methoxymethyl)benzene/phenol copolymer | 26834-02-6 | 5.45200 | 4.00000 | 2.33891 | |
Non hazardous | Proprietary | 5.58830 | 4.10000 | 2.39738 | ||
Tetramethylbiphenyl diglycidyl ether | 85954-11-6 | 2.72600 | 2.00000 | 1.16945 | ||
subTotal | 136.30000 | 100.00000 | 58.47269 | |||
Wire | Pure metal | Gold (Au) | 7440-57-5 | 0.64147 | 99.00000 | 0.27519 |
Palladium (Pd) | 7440-05-3 | 0.00648 | 1.00000 | 0.00278 | ||
subTotal | 0.64795 | 100.00000 | 0.27797 | |||
total | 233.10028 | 100.00000 | 100.00000 |
免责声明 |
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本文档中提供的所有信息只为考察或参考目的。本文档中的所有信息据信是准确和可靠的。但是,安世半导体对此处所含信息的准确性或完整性不做任何说明或保证,并对因使用此信息而带来的后果不承担任何责任。安世半导体可能随时更改本文档所发布的信息,恕不另行通知。来自不同生产地的产品可能存在细微差异。本文档将取代并替换之前就此提供的所有信息。本文档中的任何信息均不得被理解或解释为出售可接受的产品的要约,或者授予、转让或暗示任何版权、专利或其他工业或知识产权的任何许可。 |
中国RoHS信息
Name of the part 部件名称 | 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) |
---|---|---|---|---|---|---|
Adhesive 粘合剂 | O | O | O | O | O | O |
Die 晶粒 | O | O | O | O | O | O |
Lead Frame 引线框 | O | O | O | O | O | O |
Mould Compound 注塑胶料 | O | O | O | O | O | O |
Wire 线 | O | O | O | O | O | O |
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit. |
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years. |
disclaimer 免责声明 |
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 |