化学成分 74HCT4852PW-Q100

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号封装封装说明总产品重量
74HCT4852PW-Q100SOT403-1TSSOP1667.97665 mg
12NC有效的版本无铅焊接含铅焊接处理周期数组装厂RHF指示符
MSLPPTMPPTMSLPPTMPPT
9352 984 731182018-11-124126030 s124020 s3Bangkok, Thailand 
9352 984 736532015-06-222126030 s124020 s3Bangkok, Thailand 
次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
AdhesiveFillerSilver (Ag)7440-22-40.3893077.860000.57270
PolymerAcrylic resinProprietary0.0759015.180000.11166
Resin systemProprietary0.034806.960000.05119
subTotal0.50000100.000000.73555
DieDoped siliconSilicon (Si)7440-21-31.27502100.000001.87567
subTotal1.27502100.000001.87567
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700054.48724
Iron (Fe)7439-89-60.912002.400001.34164
Phosphorous (P)7723-14-00.011400.030000.01677
Zinc (Zn)7440-66-60.038000.100000.05590
subTotal38.00000100.0000055.90155
Mould CompoundAdditiveNon hazardousProprietary1.251094.700001.84048
FillerSilica fused60676-86-021.0290179.0000030.93564
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.597146.000002.34954
PigmentCarbon black1333-86-40.053240.200000.07832
Polymer1.4-bis(methoxymethyl)benzene/phenol copolymer26834-02-61.064764.000001.56636
Non hazardousProprietary1.091384.100001.60552
Tetramethylbiphenyl diglycidyl ether85954-11-60.532382.000000.78318
subTotal26.61900100.0000039.15903
Pre-platingPure metal layerGold (Au)7440-57-50.045003.000000.06620
Nickel (Ni) - cas no. 7440-02-07440-02-01.3845092.300002.03673
Palladium (Pd)7440-05-30.046503.100000.06841
Silver (Ag)7440-22-40.024001.600000.03531
subTotal1.50000100.000002.20664
WirePure metalCopper (Cu)7440-50-80.08264100.000000.12157
subTotal0.08264100.000000.12157
total67.97665100.00000100.00000
免责声明
本文档中提供的所有信息只为考察或参考目的。本文档中的所有信息据信是准确和可靠的。但是,Nexperia对此处所含信息的准确性或完整性不做任何说明或保证,并对因使用此信息而带来的后果不承担任何责任。Nexperia可能随时对本文所发布的信息进行更改,恕不另行通知。来自不同生产地的产品可能存在细微差异。本文档将取代并替换之前就此提供的所有信息。本文件中的任何信息均不得被理解或解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或其他工业或知识产权的任何许可。

中国RoHS信息

Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Adhesive
粘合剂
OOOOOO
Die
晶粒
OOOOOO
Lead Frame Material
极片材料
OOOOOO
Mould Compound
注塑胶料
OOOOOO
Pre-plating
预电镀
OOOOOO
Wire
线
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.
disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。