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化学成分 PMPB23XNE

作为一家积极进取的可持续发展公司,安世半导体已决定直接通过互联网发布其产品组合的化学成分信息。藉由此信息,恩智浦可以向我们的客户提供相关资料,以协助他们进行RoHS指令或无铅状态合规评估。客户可以直接从一般产品数据库检索中获取这些详细的数据,这是安世半导体为半导体产业设下的一个行业标准。安世半导体产品符合欧盟RoHS指令、ELV和中国RoHS。详细资料请见限用物质声明。Restricted Substances Declaration.

型号封装封装说明总产品重量
PMPB23XNESOT1220SOT12207.20508 mg
12NC版本无铅焊接焊接处理周期数组装厂RHF指示符
MSLPPTMPPTMSLPPTMPPT
934066865184212601235Dongguan, China; Kuching Sarawak, Malaysia 
934066865115712601235Kuching Sarawak, Malaysia; Dongguan, China 
次组件材料组物质CAS登录号重量(毫克)次组件重量(%)总产品重量(%)
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00972
FillerSilver (Ag)7440-22-40.0588084.000000.81609
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09715
Isobornyl Methacrylate7534-94-30.003505.000000.04858
subTotal0.07000100.000000.97154
DieDoped siliconSilicon (Si)7440-21-30.31000100.000004.30252
subTotal0.31000100.000004.30252
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.54175
Magnesium (Mg)7439-95-40.004220.145900.05852
Nickel (Ni)7440-02-00.084352.918801.17075
Silicon (Si)7440-21-30.018280.632400.25366
Pure metal layerGold (Au)7440-57-50.000960.033300.01336
Nickel (Ni)7440-02-00.074012.561001.02723
Palladium (Pd)7440-05-30.003270.113000.04532
subTotal2.89000100.0000040.11059
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.90688
Silica fused60676-86-02.2380060.0000031.06142
Flame retardantMetal hydroxideProprietary0.111903.000001.55307
ImpurityBismuth (Bi)7440-69-90.018650.500000.25885
PigmentCarbon black1333-86-40.018650.500000.25885
PolymerEpoxy resin systemProprietary0.261107.000003.62383
Phenolic resinProprietary0.223806.000003.10614
subTotal3.73000100.0000051.76904
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.35803
subTotal0.17000100.000002.35945
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0350899.990000.48690
subTotal0.03508100.000000.48695
total7.20508100.00000100.00000
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