 
74AUP3G04
Low-power triple inverter
The 74AUP3G04 provides a low-power, low-voltage triple inverting buffer.
Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.
Features and benefits
- Wide supply voltage range from 0.8 V to 3.6 V 
- High noise immunity 
- Complies with JEDEC standards: - JESD8-12 (0.8 V to 1.3 V) 
- JESD8-11 (0.9 V to 1.65 V) 
- JESD8-7 (1.2 V to 1.95 V) 
- JESD8-5 (1.8 V to 2.7 V) 
- JESD8-B (2.7 V to 3.6 V) 
 
- Low static power consumption; ICC = 0.9 μA (maximum) 
- Latch-up performance exceeds 100 mA per JESD 78B Class II 
- Inputs accept voltages up to 3.6 V 
- Low noise overshoot and undershoot < 10 % of VCC 
- IOFF circuitry provides partial Power-down mode operation 
- ESD protection: - HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V 
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V 
 
- Multiple package options 
- Specified from -40 °C to +85 °C and -40 °C to +125 °C 
参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | 
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP3G04DC | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 203 | 30.4 | 113 | VSSOP8 | 
| 74AUP3G04GN | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 238 | 148 | XSON8 | |
| 74AUP3G04GS | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 276 | 146 | XSON8 | |
| 74AUP3G04GT | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 327 | 5 | 157 | XSON8 | 
封装
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| 74AUP3G04DC | 74AUP3G04DC,125 (935280705125) | Active | p04 |   VSSOP8 (SOT765-1) | SOT765-1 | SOT765-1_125 | |
| 74AUP3G04GN | 74AUP3G04GN,115 (935291766115) | Active | p4 |   XSON8 (SOT1116) | SOT1116 | REFLOW_BG-BD-1 | SOT1116_115 | 
| 74AUP3G04GS | 74AUP3G04GS,115 (935292792115) | Active | p4 |   XSON8 (SOT1203) | SOT1203 | REFLOW_BG-BD-1 | SOT1203_115 | 
| 74AUP3G04GT | 74AUP3G04GT,115 (935280754115) | Active | p04 |   XSON8 (SOT833-1) | SOT833-1 | SOT833-1_115 | 
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| 74AUP3G04GD | 74AUP3G04GD,125 (935290383125) | Obsolete | p04 Standard Procedure Standard Procedure |   XSON8 (SOT996-2) | SOT996-2 | SOT996-2_125 | |
| 74AUP3G04GF | 74AUP3G04GF,115 (935291496115) | Obsolete | p4 |   XSON8 (SOT1089) | SOT1089 | REFLOW_BG-BD-1 | SOT1089_115 | 
| 74AUP3G04GM | 74AUP3G04GM,125 (935281439125) | Obsolete | p04 |   XQFN8 (SOT902-2) | SOT902-2 | SOT902-2_125 | 
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 
|---|---|---|---|---|
| 74AUP3G04DC | 74AUP3G04DC,125 | 74AUP3G04DC |  |   | 
| 74AUP3G04GN | 74AUP3G04GN,115 | 74AUP3G04GN |  |   | 
| 74AUP3G04GS | 74AUP3G04GS,115 | 74AUP3G04GS |  |   | 
| 74AUP3G04GT | 74AUP3G04GT,115 | 74AUP3G04GT |  |   | 
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 
|---|---|---|---|---|
| 74AUP3G04GD | 74AUP3G04GD,125 | 74AUP3G04GD |  |   | 
| 74AUP3G04GF | 74AUP3G04GF,115 | 74AUP3G04GF |  |   | 
| 74AUP3G04GM | 74AUP3G04GM,125 | 74AUP3G04GM |  |   | 
文档 (32)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| 74AUP3G04 | Low-power triple inverter | Data sheet | 2023-07-31 | 
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 | 
| AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| 001aah793 | Block diagram: 74AUP3G04DC, 74AUP3G04GM, 74AUP3G04GT | Block diagram | 2009-11-03 | 
| mna110 | Block diagram: 74AHC3G04DC, 74AHC3G04DP, 74AHC3G04GD, 74AHCT3G04DC, 74AHCT3G04DP, 74AHCT3G04GD, 74AUP1G04GM, 74AUP1G04GW, 74AUP3G04DC, 74AUP3G04GM, 74AUP3G04GT | Block diagram | 2009-11-04 | 
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 | 
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 | 
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 | 
| SOT1089 | 3D model for products with SOT1089 package | Design support | 2019-10-07 | 
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 | 
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 | 
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 | 
| aup3g04 | aup3g04 IBIS model | IBIS model | 2013-04-07 | 
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 | 
| XSON8_SOT1089_mk | plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 | 
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 | 
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 | 
| SOT996-2 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | Package information | 2020-04-21 | 
| SOT1089 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Package information | 2022-06-03 | 
| SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 | 
| SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 | 
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 | 
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 | 
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 | 
| MAR_SOT1089 | MAR_SOT1089 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 | 
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 | 
支持
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模型
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 | 
| SOT1089 | 3D model for products with SOT1089 package | Design support | 2019-10-07 | 
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 | 
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 | 
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 | 
| aup3g04 | aup3g04 IBIS model | IBIS model | 2013-04-07 | 
Ordering, pricing & availability
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