双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74CBTLV1G125-Q100

Single bus switch

The 74CBTLV1G125-Q100 is a single high-speed line switch. The switch is disabled when the output enable (OE) input is high.

To ensure the high-impedance OFF-state during power-up or power-down, tie OE to the VCC through a pull-up resistor. The current-sinking capability of the driver determines the minimum value of the resistor.

Schmitt-trigger action at control inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Supply voltage range from 2.3 V to 3.6 V

  • Overvoltage tolerant control inputs to 3.6 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • 5 Ω switch connection between two ports

  • Rail to rail switching on data I/O ports

  • CMOS low power consumption

  • Latch-up performance meets requirements of JESD78 Class I

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

型号 VCC (V) RON (Ω) Logic switching levels tpd (ns) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74CBTLV1G125GV-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 259 56.6 160 TSOP5
74CBTLV1G125GW-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 300 71.7 171 TSSOP5

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74CBTLV1G125GV-Q100 74CBTLV1G125GV-Q1H
(935691828125)		 Active b25 SOT753
TSOP5
(SOT753) 		SOT753 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125
74CBTLV1G125GW-Q100 74CBTLV1G125GW-Q1H
(935691830125)		 Active bM SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74CBTLV1G125GV-Q100 74CBTLV1G125GV-Q1H 74CBTLV1G125GV-Q100 rohs rhf rhf
74CBTLV1G125GW-Q100 74CBTLV1G125GW-Q1H 74CBTLV1G125GW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (12)

文件名称 标题 类型 日期
74CBTLV1G125_Q100 Single bus switch Data sheet 2024-06-24
AN90063 Questions about package outline drawings Application note 2025-06-13
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT753 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Package information 2022-05-31
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT753 MAR_SOT753 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23

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