双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HC574-Q100; 74HCT574-Q100

Octal D-type flip-flop; positive edge-trigger; 3-state

The 74HC574-Q100; 74HCT574-Q100 is an 8-bit positive-edge triggered D-type flip-flop with 3-state outputs. The device features a clock (CP) and output enable (OE) inputs. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • CMOS low power dissipation

  • High noise immunity

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8C (2.7 V to 3.6 V)

    • JESD7A (2.0 V to 6.0 V)

  • Input levels:

    • For 74HC574-Q100: CMOS level

    • For 74HCT574-Q100: TTL level

  • 3-state non-inverting outputs for bus oriented applications

  • 8-bit positive, edge-triggered register

  • Common 3-state output enable input

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74HC574BQ-Q100 2.0 - 6.0 CMOS ± 7.8 14 133 low -40~125 77 8.1 48.1 DHVQFN20
74HC574D-Q100 2.0 - 6.0 CMOS ± 7.8 14 133 low -40~125 85 27.5 61 SO20
74HC574PW-Q100 2.0 - 6.0 CMOS ± 7.8 14 133 low -40~125 100 4.6 44.9 TSSOP20
74HCT574D-Q100 4.5 - 5.5 TTL ± 6 15 76 low -40~125 85 27.5 61 SO20
74HCT574PW-Q100 4.5 - 5.5 TTL ± 6 15 76 low -40~125 100 4.6 44.9 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HC574BQ-Q100 74HC574BQ-Q100X
(935691307115)		 Active 74HC574B SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74HC574D-Q100 74HC574D-Q100,118
(935298937118)		 Active 74HC574D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74HC574PW-Q100 74HC574PW-Q100,118
(935298938118)		 Active HC574 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118
74HCT574D-Q100 74HCT574D-Q100,118
(935298939118)		 Active 74HCT574D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74HCT574PW-Q100 74HCT574PW-Q100,11
(935298941118)		 Active HCT574 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HC574BQ-Q100 74HC574BQ-Q100X 74HC574BQ-Q100 rohs rhf rhf
74HC574D-Q100 74HC574D-Q100,118 74HC574D-Q100 rohs rhf rhf
74HC574PW-Q100 74HC574PW-Q100,118 74HC574PW-Q100 rohs rhf rhf
74HCT574D-Q100 74HCT574D-Q100,118 74HCT574D-Q100 rohs rhf rhf
74HCT574PW-Q100 74HCT574PW-Q100,11 74HCT574PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (15)

文件名称 标题 类型 日期
74HC_HCT574_Q100 Octal D-type flip-flop; positive edge-trigger; 3-state Data sheet 2024-08-05
AN11044 Pin FMEA 74HC/74HCT family Application note 2019-01-09
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2024-11-15
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
HCT_USER_GUIDE HC/T User Guide User manual 1997-10-31
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22

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