参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LV02APW | 2.0 - 5.5 | CMOS | ± 12 | 4.3 | 45 | 4 | low | -40~125 | 140 | 7.5 | 66 | TSSOP14 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LV02APW | 74LV02APWJ (935690647118) |
Active | 74LV02A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LV02BQ | 74LV02BQ,115 (935285564115) |
Obsolete | no package information | ||||
| 74LV02D | 74LV02D,112 (935063110112) |
Obsolete |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 | |
| 74LV02D,118 (935063110118) |
Withdrawn / End-of-life | SOT108-1_118 | |||||
| 74LV02PW | 74LV02PW,112 (935174160112) |
Obsolete | no package information | ||||
文档 (16)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LV02 | Quad 2-input NOR gate | Data sheet | 2017-05-10 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| mna216 | Block diagram: 74AHC02BQ, 74AHC02D, 74AHC02PW, 74AHCT02BQ, 74AHCT02D, 74AHCT02PW, 74ALVC02BQ, 74ALVC02D, 74ALVC02PW, 74LV02BQ, 74LV02D, 74LV02PW, 74LVC02ABQ, 74LVC02AD, 74LVC02ADB, 74LVC02APW, 74HC02BQ, 74HC02D, 74HC02DB, 74HC02N, 74HC02PW, 74HCT02BQ, 74HCT02D, 74HCT02DB, 74HCT02N, 74HCT02PW | Block diagram | 2009-11-04 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| lv02 | 74LV02 IBIS model | IBIS model | 2019-01-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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